NDLI: Analytical Thermal Model of a Generic Multi-Layer Spacerless 3D Package

Content Provider	The American Society of Mechanical Engineers (ASME) Digital Collection
Author	Rodrigo, Nuwan Ghalambor, Saeed Haji-Sheikh, Abdolhossein Agonafer, Dereje
Copyright Year	2011
Abstract	The need for more functions in a single device has led to die stacking architecture. Although the number of die increases further to accommodate package functionality, the overall package dimensions have not increased; they have stayed the same or decreased (roughly 1.4mm). If this trend continues, in order to keep the same package height, alternate stacking structures need to be investigated. One such opportunity is the spacerless die stacking architecture. Using dummy silicon spacers add to the cost of a package and do not increase the memory or functionality, although they serve as enablers for wire bonding of same size die. Spacerless architecture reduces the package height by eliminating spacers or dummy die. This allows for an increased number of active die to be stacked directly on one another without changing the overall package height, or in some cases reducing the package height. Previous work [1] has been done to develop a steady-state heat conduction model in a two-layer body. This analytical model will be extended to the current multi-layered generic spacerless three dimensional packages (3DP) enabling the computation of temperature for uniform or non-uniform powered die. The computation will account for the contact resistance created by the die attach and the solder balls. Finally validation of this analytically developed model will be carried out with a numerical model.
Starting Page	889
Ending Page	896
Page Count	8
File Format	PDF
ISBN	9780791854976
DOI	10.1115/IMECE2011-64608
Volume Number	Volume 11: Nano and Micro Materials, Devices and Systems; Microsystems Integration
Conference Proceedings	ASME 2011 International Mechanical Engineering Congress and Exposition
Language	English
Publisher Date	2011-11-11
Publisher Place	Denver, Colorado, USA
Access Restriction	Subscribed
Subject Keyword	Heat conduction Solders Temperature Computer simulation Wire bonding Computation Contact resistance Dimensions Silicon Steady state
Content Type	Text
Resource Type	Article

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