NDLI: 6-24 GHz Mixer Using 0.25 μm Enhancement Mode PHEMT Technology in a Low Cost Chip Scale Package

Content Provider	IEEE Xplore Digital Library
Author	Kumar, S. Kessler, J. Morkner, H.
Copyright Year	2008
Description	Author affiliation: Avago Technol., San Jose, CA (Kumar, S.; Kessler, J.; Morkner, H.)
Abstract	This paper discusses development of a 6-24 GHz mixer in a novel chip scale package. The mixer and package was fabricated together using Avago's enhancement mode (E-mode) PHEMT technology. This chip scale package is high performance, low cost and it totally eliminates all the assembly steps (such as die attach, bond wire etc) required to package a singulated die in a package. The mixer has been tested at two different stages of fabrication, first Un-Capped (like without top-lid in case of conventional package) and after final GaAs-Capped (with top-lid on). The measured conversion loss of un-capped mixer is ~9 dB upto 22 GHz @LO=+16 dBm. Conversion loss of capped wafer is marginally lower than uncapped mixer upto 22 GHz. The IIP3 of uncapped mixer mixer is about +19 dBm and capped mixer IIP3 is about 1-2 dB lower than Capped mixer in most of the band. Rest of the performances of (Capped and Un-capped) mixers are very similar. L-R Isolation ~35 dB, L-I Isolation ~40 dB. IF test frequency is 2 GHz. To the best of author's knowledge this is the first reported chip scale packaged Mixer.
Starting Page	238
Ending Page	241
File Size	413008
Page Count	4
File Format	PDF
ISBN	9782874870071
DOI	10.1109/EMICC.2008.4772273
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-27
Publisher Place	Netherlands
Access Restriction	Subscribed
Rights Holder	European Microwave Assoc.
Subject Keyword	Fabrication Costs PHEMTs Wire Chip scale packaging Bonding Mixers Assembly Testing Microassembly
Content Type	Text
Resource Type	Article

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