NDLI: Microwave Compact Passive Circuit Model of Isolated Interconnect over a Silicon Substrate with a Through-Silicon Via (TSV) Ground Supply Network

Content Provider	IEEE Xplore Digital Library
Author	Woods, W. Guoan Wang Hanyi Ding
Copyright Year	2008
Description	Author affiliation: IBM Microelectron., Essex Junction, VT (Woods, W.; Guoan Wang; Hanyi Ding)
Abstract	As operating frequencies increase in state-of-the-art wireless designs, highly accurate modelling of critical interconnect paths routed over silicon is crucial for first-pass design success [1]. With this in mind, the interconnect stack of an IBM silicon germanium (SiGe) process incorporating a TSV ground supply network was modelled with model accuracy and efficiency as the goals. A unique modelling methodology for assigning the values of silicon skin-effect circuit model elements is discussed. The final model is verified with hardware measurements and found to accurately estimate the frequency-dependent resistance, capacitance, and inductance of a single line over silicon at microwave frequencies in a compact, efficient, pre-layout circuit model that includes the effects of process variation.
Starting Page	342
Ending Page	345
File Size	779349
Page Count	4
File Format	PDF
ISBN	9782874870071
DOI	10.1109/EMICC.2008.4772299
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-27
Publisher Place	Netherlands
Access Restriction	Subscribed
Rights Holder	European Microwave Assoc.
Subject Keyword	Germanium silicon alloys Integrated circuit interconnections Passive circuits Frequency estimation Hardware Capacitance measurement Electrical resistance measurement Through-silicon vias Inductance measurement Silicon germanium
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
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