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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bahukudumbi, S. Chakrabarty, K. |
| Copyright Year | 2006 |
| Description | Author affiliation: Dept. of Electr. & Comput. Eng., Duke Univ., Durham, NC (Bahukudumbi, S.; Chakrabarty, K.) |
| Abstract | Product cost is a major driver in the consumer electronics market, which is characterized by low profit margins and the use of core-based system-on-chip (SoC) designs. Packaging has been recognized as a significant contributor to the product cost for such SoCs. To reduce packaging cost and the test cost for packaged chips, wafer-level testing (wafer sort) is used in the semiconductor industry to screen defective dies. However, since test time is a major practical constraint for wafer sort, even more so than for package test, not all the scan-based digital tests can be applied to the die under test. We present an optimal test-length selection technique for wafer-level testing of core-based SoCs. This technique, which is based on a combination of statistical yield modeling and integer linear programming, allows us to determine the number of patterns to use for each embedded core during wafer sort such that the probability of screening defective dies is maximized for a given upper limit on the SoC test time. Simulation results are presented for five of the ITC'02 SoC test benchmarks |
| Starting Page | 1 |
| Ending Page | 10 |
| File Size | 954473 |
| Page Count | 10 |
| File Format | |
| ISBN | 1424402913 |
| ISSN | 10893539 |
| DOI | 10.1109/TEST.2006.297646 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2006-10-22 |
| Publisher Place | USA |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Costs Semiconductor device packaging Wafer scale integration Electronics packaging Semiconductor device testing Driver circuits Consumer electronics System-on-a-chip Electronics industry Semiconductor device modeling |
| Content Type | Text |
| Resource Type | Article |
| Subject | Applied Mathematics Electrical and Electronic Engineering |
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