NDLI: Thermal analysis of fully integrated RF single-package module for GSM quad band handsets

Content Provider	IEEE Xplore Digital Library
Author	Kyoung-Chul Park Sungkil Hwang Jakwon Koo
Copyright Year	2005
Description	Author affiliation: Dept.1 / Component R&D Lab., LG Innotek Co.Ltd, Anyang, South Korea (Kyoung-Chul Park; Sungkil Hwang; Jakwon Koo)
Abstract	The thermal analysis of fully integrated RF single-package module (RSPM) for GSM quad band handsets is presented. The RSPM includes RFIC transceiver, GaAs power amplifier (PA), SP6T RF switch, and RF SAW filters in addition to control circuitry and matching components. Multi-layer laminate organic substrate has been chosen due to lower cost than LTCC substrate and maturity of the technology. Size of the RSPM is 13mm /spl times/ 13mm /spl times/ 1.5mm. The thermal impact mainly caused by high power amplifier affects the electrical performance of RF SAW filters and this result in Rx sensitivity degradation of RSPM in in-band edge. Three-dimensional tangential vector finite element method (FEM) model is used to predict the optimal RSPM design with good electrical performance and lower costs, while maintaining reasonable thermal performance. An infrared microscope system is used to measure RSPM temperature with both RF and dc power. The comparison between the numerical and experiment data indicates agreement with less than 14.5% difference in peak temperature. The optimal distance from SAW filters to GSM PA and optimal number of thermal vias under the SAW filter area are 7.1mm and 4, respectively. The measured results of RSPM show reasonable thermal performance and good electrical performance.
Sponsorship	IEEE - CPMT
Starting Page	670
Ending Page	674
File Size	847037
Page Count	5
File Format	PDF
ISBN	0780390628
DOI	10.1109/ESIME.2005.1502886
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-04-18
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Radio frequency GSM Telephone sets SAW filters Switches Temperature measurement Radiofrequency integrated circuits Transceivers Gallium arsenide Power amplifiers
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

A single-chip quad-band (850/900/1800/1900 MHz) direct-conversion GSM/GPRS RF transceiver with integrated VCOs and fractional-N synthesizer

LTCC quad band GSM RF transceiver using integrated passive matching network

LTCC quad band GSM RF transceiver using integrated passive matching network

A 2.7 V GSM RF transceiver IC

RF front-end modules in cellular handsets

A highly integrated quad band low EVM polar modulation transmitter for GSM/EDGE applications

Miniaturized Quad-Band Front-End Module for GSM using Si BiCMOS and passive integration technologies

A 2.7 V to 4.5 V single-chip GSM transceiver RF integrated circuit

A 2.7-4.5 V single chip GSM transceiver RF integrated circuit

Thermal analysis of fully integrated RF single-package module for GSM quad band handsets

Similar Documents

A single-chip quad-band (850/900/1800/1900 MHz) direct-conversion GSM/GPRS RF transceiver with integrated VCOs and fractional-N synthesizer

LTCC quad band GSM RF transceiver using integrated passive matching network

LTCC quad band GSM RF transceiver using integrated passive matching network

A 2.7 V GSM RF transceiver IC

RF front-end modules in cellular handsets

A highly integrated quad band low EVM polar modulation transmitter for GSM/EDGE applications

Miniaturized Quad-Band Front-End Module for GSM using Si BiCMOS and passive integration technologies

A 2.7 V to 4.5 V single-chip GSM transceiver RF integrated circuit

A 2.7-4.5 V single chip GSM transceiver RF integrated circuit

Thermal analysis of fully integrated RF single-package module for GSM quad band handsets