NDLI: Oxide development on coated copper contacts

Content Provider	IEEE Xplore Digital Library
Author	Reid, M. Punch, J. Galkin, T. Vakevainen, K. Stenberg, T. Vilen, M. Pomeroy, M.J. Mihov, M.
Copyright Year	2005
Description	Author affiliation: Stokes Res. Inst., Limerick Univ., Ireland (Reid, M.; Punch, J.)
Abstract	Corrosion of components within electronic systems can produce a wide range of consequences from intermittent electrical faults to complete functional breakdown. Temperature and relative humidity are key environmental parameters, which control corrosion. This paper presents an investigation of copper contacts plated with gold, palladium-nickel and nickel exposed to steady-state damp heat conditions. Studies were conducted to evaluate the oxide development on the contacts after steady-state exposure using scanning electron microscopy (SEM), energy dispersive X-ray spectroscopy (EDAX), focused ion beam (FIB), and secondary ion mass spectroscopy (SIMS). The diffusion of copper to the gold surface is the rate-limiting step in the corrosion process and the nickel layer acts as a diffusion barrier. It is shown, however, that the nickel layer retards - but does not prevents diffusion. The oxide development on the gold surface is shown to increase slightly with increasing relative humidity with a critical relative humidity shown to above 90%RH.
Sponsorship	IEEE - CPMT
Starting Page	330
Ending Page	334
File Size	961178
Page Count	5
File Format	PDF
ISBN	0780390628
DOI	10.1109/ESIME.2005.1502823
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-04-18
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Copper Contacts Corrosion Humidity Gold Nickel Steady-state Scanning electron microscopy Mass spectroscopy Electric breakdown
Content Type	Text
Resource Type	Article

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