NDLI: Probabilistic design approach for package design and solder joint reliability optimization for a lead free BGA package

Content Provider	IEEE Xplore Digital Library
Author	Limaye, P. Vandevelde, B. Van de Peer, J. Donders, S. Darveaux, R.
Copyright Year	2005
Description	Author affiliation: IMEC, Leuven, Belgium (Limaye, P.; Vandevelde, B.)
Abstract	The natural variations that exist in the material properties and manufacturing processes in the assembly of an IC device can impact the solder joint reliability. It would be desirable and more efficient if these variations were incorporated into the design so that when all variations are taken into account, the assembled device always operates away from the failure domain. It is well known that a deterministic optimum is not always a reliable solution as scatter on the inputs may propagate into scatter on the outputs and even small parameter changes may have substantial effects on the functional performance. The deterministic optimum has to be shifted to a reliable optimum. By taking into account realistic variability, it is ensured that constraints on performance targets are never violated. This requires an incorporation of a probabilistic design methodology in the FE simulations. In this paper, a complete reliability optimization case will be shown for a lead free BGA package mounted on a PCB. The parameters being optimized are the material properties of the molding compound and the dimensions of the package while the optimized responses are the warpage of the package at room temperature and the solder joint reliability. For the reliability index calculations, a state-of-the-art FORM (first order reliability method) algorithm is used. For the optimization, a new efficient global optimization algorithm is proposed, an iterative method using Kriging response surface models and smart selection of design points, that converges to the optimal solution in a minimum number of simulations.
Sponsorship	IEEE - CPMT
Starting Page	531
Ending Page	537
File Size	1256928
Page Count	7
File Format	PDF
ISBN	0780390628
DOI	10.1109/ESIME.2005.1502862
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-04-18
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Packaging Soldering Design optimization Environmentally friendly manufacturing techniques Lead Material properties Assembly Materials reliability Scattering parameters Iterative algorithms
Content Type	Text
Resource Type	Article

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