NDLI: Analysis of Cu/low-k bond pad delamination by using a novel failure index

Content Provider	IEEE Xplore Digital Library
Author	van Gils, M.A.J. van der Sluis, O. Zhang, G.Q. Janssen, J.H.J. Voncken, R.M.J.
Copyright Year	2005
Description	Author affiliation: Philips Appl. Technol., Eindhoven, Netherlands (van Gils, M.A.J.; van der Sluis, O.; Zhang, G.Q.)
Abstract	For the development of state-of-the-art Cu/low-k CMOS technologies, the integration and introduction of new low-k materials are one of the major bottlenecks due to the bad thermal and mechanical integrity of these materials and the inherited weak interfacial adhesion. Especially the forces resulting from packaging related processes such as dicing, wire bonding, bumping and molding are critical and can easily result in cracking, delamination and chipping of the IC back-end structure if no appropriate measures are taken. This paper presents a methodology for optimizing the thermo-mechanical reliability of bond pads by using a 3D multi-scale finite element approach. An important characteristic of this methodology is the use of a novel energy-based failure index, which allows a fast qualitative comparison of different back-end structures. The usability of the methodology will be illustrated by the comparison of three different bond pad structures.
Sponsorship	IEEE - CPMT
Starting Page	190
Ending Page	196
File Size	1181823
Page Count	7
File Format	PDF
ISBN	0780390628
DOI	10.1109/ESIME.2005.1502798
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-04-18
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Failure analysis Delamination CMOS technology Adhesives Integrated circuit packaging Wire Bonding forces Force measurement Semiconductor device measurement Optimization methods
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Efficient Damage Sensitivity Analysis of advanced Cu Low-k Bond Pad Structures Using Area Release Energy

Novel Damage Model for Delamination in Cu/low-k IC Backend Structures

Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

Multi-scale energy-based failure modeling of bond pad structures

A criterion for predicting delamination in plastic IC packages

Effects of die pad anchoring on package interfacial integrity

Wire Bond Integrity Test Chip

Predicting delamination in plastic IC packages and determining suitable mold compound properties

In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors (1998)

Analysis of Cu/low-k bond pad delamination by using a novel failure index

Similar Documents

Efficient Damage Sensitivity Analysis of advanced Cu Low-k Bond Pad Structures Using Area Release Energy

Novel Damage Model for Delamination in Cu/low-k IC Backend Structures

Fine pitch copper wire bonding on 45nm tech Cu/low-k chip with different bond pad metallurgy

Multi-scale energy-based failure modeling of bond pad structures

A criterion for predicting delamination in plastic IC packages

Effects of die pad anchoring on package interfacial integrity

Wire Bond Integrity Test Chip

Predicting delamination in plastic IC packages and determining suitable mold compound properties

In-situ Measurement of Stress and Temperature under Bonding Pads During Wire Bonding Using Integrated Microsensors (1998)

Analysis of Cu/low-k bond pad delamination by using a novel failure index