NDLI: Correct modelling of geometry and materials properties in the thermo-mechanical finite-elements-simulation of chip scale packages

Content Provider	IEEE Xplore Digital Library
Author	Zukowski, E. Deier, E. Wiide, J.
Copyright Year	2005
Description	Author affiliation: IMTEK, Freiburg Univ., Germany (Zukowski, E.; Deier, E.; Wiide, J.)
Abstract	The first part of the work reported here is dedicated to the 3D finite-elements modelling of CSP. It will take into account both thermal-mechanical characteristics of the assembly materials and geometric factors. Here an approach of modular and parametric modelling with standardized modules linked via contact elements is proposed. Also the aspects of CAD systems for parameterized modelling are treated. The modular concept of modelling also will allow for efficient calculations with a variable number of bumps. The second part of the paper is dedicated to the materials descriptions, which is necessary for the simulation of CSP assemblies. Measured materials data as well as suitable models for numerical representations are discussed. The relevant thermo-mechanical properties of package and assembly materials are presented. Besides actual solder alloys also polymers like moulding compounds are treated. In order to calibrate and check the simulation results, an ESPI sensor was used for measuring the thermal deformations of specimens under thermal loads in comparison to finite elements simulations. FE-models validated by experimental results present the deformations and stress state of the package under thermal cycling.
Sponsorship	IEEE - CPMT
Starting Page	545
Ending Page	552
File Size	1454218
Page Count	8
File Format	PDF
ISBN	0780390628
DOI	10.1109/ESIME.2005.1502865
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2006-04-18
Publisher Place	Germany
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Solid modeling Geometry Material properties Thermomechanical processes Finite element methods Chip scale packaging Assembly Deformable models Thermal loading Thermal stresses
Content Type	Text
Resource Type	Article

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