NDLI: A 3D micro-channel cooling system embedded in LTCC packaging substrate

Content Provider	IEEE Xplore Digital Library
Author	Songtao Jia Min Miao Runiu Fang Shichao Guo Duwei Hu Yufeng Jin
Copyright Year	2012
Description	Author affiliation: National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Peking University, China (Min Miao) \|\| Information Engineering Institute of Peking University, Shenzhen, China (Songtao Jia; Runiu Fang; Shichao Guo; Duwei Hu; Yufeng Jin)
Abstract	Micro fluidic channel embedded in LTCC packaging substrate is reported in IEEE-NEMS 2010 by our team, which showed that the micro channel can promise a great effect on heat-dissipating of the heat resource packaged in the LTCC substrate. Yet we find there is more room to intensify this effect. So we design a 3-D micro channel embedded in LTCC substrate which is not fabricated in one single layer but fabricated through multilayer substrate and constitute a channel circle surrounding the heat resource packaged inside. We accomplished some simulation on heat distribution, flow pressure and flow velocity field with commercial software FLUENT. This new structure can promise a much better effect on heat redistribution compared to single layer micro channel embedded in LTCC substrate. With this fluid channel the temperature of the outside package is tremendously cut down.
Starting Page	649
Ending Page	652
File Size	1253819
Page Count	4
File Format	PDF
ISBN	9781467311229
e-ISBN	9781467311243
DOI	10.1109/NEMS.2012.6196859
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-03-05
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Fluids Heat engines Lead Nanoelectromechanical systems Cavity resonators Packaging micro fluid channel system-in-package (SiP) LTCC(low temperature co-fired ceramic)
Content Type	Text
Resource Type	Article

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