NDLI: Mechanical strength and reliability of a novel thin monocrystalline silicon solar cell

Content Provider	IEEE Xplore Digital Library
Author	Dewei Xu Ho, P.S. Rao, R.A. Mathew, L. Smith, S. Saha, S. Sarkar, D. Vass, C. Jawarani, D.
Copyright Year	2012
Description	Author affiliation: Microelectronics Research Center, The University of Texas at Austin, 78758, USA (Dewei Xu; Ho, P.S.) \|\| AstroWatt Inc., Austin, TX 78758, USA (Rao, R.A.; Mathew, L.; Smith, S.; Saha, S.; Sarkar, D.; Vass, C.; Jawarani, D.)
Abstract	Thin crystalline silicon solar cells, on the order of a few to tens of μm thick, are of interest due to significant material cost reduction and potentially high conversion efficiency. These thin silicon films impose stringent mechanical strength and handling requirements during wafer transfer, cell processing and module integration. Quantitative mechanical and fracture analyses to address reliability issues become necessary. Based on a bi-material foil composed of thin monocrystalline silicon and a supporting substrate fabricated from a novel $SOM^{®}$ (Semiconductor on Metal) kerf-less exfoliation process, closed-form mechanical analyses are introduced and developed to evaluate their strength and fracture behaviors. These analyses include the thermal stress field in the device silicon layer and supporting substrate, the fracture behavior and effects of pyramid structures from surface texturing and the energy release rate at the silicon-substrate interface. It is shown that the introduction of the intrinsic compressive residual strain in the $SOM^{®}$ substrate expands the processing temperature spectrum. The developed analysis and methodology can be readily extended to other thin film solar cell structures with various configurations of device layers and supporting substrates.
File Size	735389
File Format	PDF
ISBN	9781457716782
ISSN	19381891
e-ISBN	9781457716805
e-ISBN	9781457716799
DOI	10.1109/IRPS.2012.6241827
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2012-04-15
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Strain Substrates Stress Photovoltaic cells Metals Films cell process temperature limit Thin crystalline silicon solar cells mechanical strength reliability thermal misfit strain stress intensity factor energy release rate
Content Type	Text
Resource Type	Article

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