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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Honda, S. Fujii, R. Kawakami, T. Fujioka, S. Narazaki, A. Motonami, K. |
| Copyright Year | 2010 |
| Description | Author affiliation: Renesas Semiconductor Engineering Corp., 997 Miyoshi Koshi, Kumamoto, 861-1197, Japan (Fujioka, S.) || Power Semiconductor Device Development Department, Mitsubishi Electric Corporation, 997 Miyoshi Koshi, Kumamoto, 861-1197, Japan (Honda, S.; Narazaki, A.; Motonami, K.) || Advanced technology R&D center, 997 Miyoshi Koshi, Kumamoto, 861-1197, Japan (Kawakami, T.) || Manufacturing Engineering Center, 997 Miyoshi Koshi, Kumamoto, 861-1197, Japan (Fujii, R.) |
| Abstract | This paper presents a novel junction termination technique, named Recess Junction Termination (RJT), for power devices. This new junction termination improves the breakdown voltage of a planar junction by a silicon recess located to create a positive bevel, which reduces the peak of electric field. The RJT can reduce a thermal budget for the RESURF (REduced SURface Field) layer by the silicon recess, and has compatibility with a fine-pitch process due to a planarization process using Chemical Mechanical Polish (CMP) treatments. After numerous simulations to optimize the structure parameters, we have succeeded in obtaining sufficient blocking capabilities of pn-RJT-diodes, the voltage ratings of which are from 75 V to 1700 V. |
| Starting Page | 111 |
| Ending Page | 114 |
| File Size | 328622 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424477180 |
| ISSN | 19460201 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2010-06-06 |
| Publisher Place | Japan |
| Access Restriction | Subscribed |
| Rights Holder | Inst of Elec Eng of Japan |
| Subject Keyword | Silicon Planarization Boron Voltage Substrates Power semiconductor devices Power engineering and energy Surface treatment Fabrication Costs |
| Content Type | Text |
| Resource Type | Article |
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