NDLI: Microsystem Interconnections Modelling Using Micropolar Theory and Discontinuous Approximation

Content Provider	IEEE Xplore Digital Library
Author	Yan Zhang Larsson, R. Jingyu Fan Zhaonian Cheng Liu, J.
Copyright Year	2005
Description	Author affiliation: Key State Lab for New Displays and System Integration (Chinese Ministry of Education), SMIT Center, Shanghai University, Shanghai 200072, China; Department of Applied Mechanics, Chalmers University of Technology, Se-412 96, Gothenburg, Sweden (Yan Zhang)
Abstract	In this paper, the micro-polar theory is used to develop a numerical model for the prediction of the behavior of the material in the vicinity of the microsystem interconnection interface as well within the interface. This model, as compared with the classical continuum theory, can offer the possibility to include the size-effect for the simulation and prediction of the microsystem packaging interconnection materials. The model has been carried out in a finite element environment, and some examples are given as the application of the model.
Starting Page	176
Ending Page	179
File Size	1382751
Page Count	4
File Format	PDF
ISBN	0780395530
DOI	10.1109/POLYTR.2005.1596512
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-23
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Conducting materials Conductive adhesives Electronics packaging Stress Predictive models Bonding Thermal degradation Polymers Displays Electronic mail Microsystem packaging Micro-polar theory discontinuous approximation
Content Type	Text
Resource Type	Article

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