NDLI: CMP of PC, PMMA and SU-8 Polymers

Content Provider	IEEE Xplore Digital Library
Author	Zhong, Z.W. Wang, Z.F. Zirajutheen, B.M.P. Tan, Y.S. Tan, Y.H.
Copyright Year	2005
Description	Author affiliation: School of Mechanical and Aerospace Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798 (Zhong, Z.W.)
Abstract	Polymers such as PC (polycarbonate), PMMA (poly methyl methacryate) and SU-8 epoxy resin are replacing silicon as the major substrate in microfluidic system (or BioMEMS) fabrication. Chemical mechanical polishing (CMP) is an important technology for many advanced microelectromechanical system (MEMS) and micro-optoelectromechanical system applications. In this study, CMP of PC, PMMA and SU-8 polymers was investigated. Four types of slurry were tested for CMP of PC and PMMA. Experiments were then designed and performed to investigate effects of two key process parameters. The experimental results show that an increase in head load or table speed would cause an increase in material removal rates (MRRs). Within the chosen experimental parameter ranges, the variation of table speed introduced a more significant change in MRRs than that of head load. ANOVA was also carried out, and it was found that the interaction of head load and table speed had a significant (95% confidence) effect on surface finish of polished PMMA samples while table speed had a significant effect on surface finish of polished PC samples. CMP is also a process well suited for polishing high-aspect-ratio SU-8 structures. Polished PC, PMMA and SU-8 surfaces had nanometer-order surface roughness, acceptable to most MEMS applications.
Starting Page	58
Ending Page	62
File Size	2851852
Page Count	5
File Format	PDF
ISBN	0780395530
DOI	10.1109/POLYTR.2005.1596487
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-23
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Polymers Rough surfaces Surface roughness Chemical technology Micromechanical devices Surface finishing Epoxy resins Silicon Microfluidics Fabrication Material removal rate MEMS Chemical mechanical polishing Surface finish
Content Type	Text
Resource Type	Article

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