NDLI: Problems of PCB Microvias Filling by Conductive Paste

Content Provider	IEEE Xplore Digital Library
Author	Kisiel, R. Felba, J. Borecki, J. Moscicki, A.
Copyright Year	2005
Description	Author affiliation: Warsaw University of Technology, Institute of Microelectronics and Optoelectronics, Koszykowa 75, 00-662 Warsaw, Poland, e-mail: rkisiel@imio.pw.edu.pl, phone: (+48 22) 660-78-52 (1), fax: (+48 22) 628 87 40 (Kisiel, R.)
Abstract	In the paper there were analyzed the using polymer-base materials for the through holes and the blind holes filling in PCBs. Such processes seem to be easy and can be used instead of electrochemical plating process. The perform investigations show that these processes are not so simple. To understand more problems connected with microvias filling, the influence of adhesive rheology and printing parameters for the quality of filling small diameter through hole and small diameter blind vias were investigated. The performed analyze was supplemented by electrical measurements as well as observation of microvia cross sections. The FR-4 laminate test samples with through holes diameters: 0.3; 0.5 and 0.8 mm as well as blind holes diameters 0.15, 0.3 and 0.45 mm were used in experiments. The average single fill resistance in the range 50 mΩ and below was measured. Obtained adhesive fill resistance is stable after dump heat and thermal shock tests.
Starting Page	96
Ending Page	101
File Size	3671248
Page Count	6
File Format	PDF
ISBN	0780395530
DOI	10.1109/POLYTR.2005.1596495
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-23
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Filling Electrical resistance measurement Testing Thermal resistance Polymers Conducting materials Rheology Printing Performance evaluation Performance analysis via filling Conductive paste interconnection microvia
Content Type	Text
Resource Type	Article

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