NDLI: Cu/LCP Laminated Materials for New Generation FPC

Content Provider	IEEE Xplore Digital Library
Author	Nanbu, K. Saijo, K. Yoshida, K. Okayama, H. Ozawa, S. Suga, T.
Copyright Year	2005
Description	Author affiliation: Technical Research Laboratory, Toyo Kohan Co., LTD, 1296 Higashitoyoi, Kudamatsu, Yamaguchi, Japan, e-mail: u5906@toyokohan.co.jp (Nanbu, K.)
Abstract	As future materials for flexible printed circuits (FPCs) with high performance, we have studied copper clad lamination (CCL) materials of liquid crystal polymer (LCP) on copper (Cu) foil using a new laminating process, so called, surface activated bonding (SAB) method [1-5]. In previous report, it was found that the loss of peel strength during the heat-resistance test was improved by using copper-0.02% zirconium (Cu-Zr) alloy foil and a thicker sputter of copper-45% nickel (Cu-45Ni) or nickel-20% chromium (Ni-20Cr) alloys [5]. These improved materials showed excellent interface conductivity at high frequency and etching property. In this report, we tried to produce more improved materials with different sputtering metals and investigated various characteristics of the laminated materials such as scattering parameter (S21), etching property, and dimensional stability for the FPCs. It was clarified that the sputter metal of higher nickel content alloys prevented from the interface oxidation of the Cu-Zr alloy foil/LCP film laminated materials (Cu-Zr/LCP materials) after heat-resistance test. Especially in copper-80% nickel (Cu-80Ni)or nickel-10% chromium (Ni-10Cr) alloy, the peel strength of the laminated materials kept around 500N/m even after 144 hour heating. The S21 of micro-strip line of the laminated materials showed half attenuation when comparing with that produced by the conventional heat bonding method. It is also shown that the Cu-Zr materials produced by the SAB method (SAB material) have excellent etching property and dimensional stability.
Starting Page	108
Ending Page	112
File Size	2228230
Page Count	5
File Format	PDF
ISBN	0780395530
DOI	10.1109/POLYTR.2005.1596497
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-23
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Flexible printed circuits Nickel alloys Inorganic materials Crystalline materials Chromium alloys Copper alloys Conducting materials Bonding Sputter etching Stability
Content Type	Text
Resource Type	Article

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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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