NDLI: Effects of Printed Circuit Board Materials on Lead-free Interconnect Durability

Content Provider	IEEE Xplore Digital Library
Author	Haiyu Qi Ganesan, S. Ji Wu Pecht, M. Matkowski, P. Felba, J.
Copyright Year	2005
Description	Author affiliation: CALCE Electronic Products and Systems Center, University of Maryland, College Park, MD 20742, USA (Haiyu Qi)
Abstract	This study investigates the effects of printed circuit board (PCB) material on interconnect durability of lead free assemblies. The assemblies involve soldering various packages (array and peripheral) on to FR4, high glass transition temperature (T) FR4 and Polyimide (PI) printed circuit boards using Sn3Ag0.5Cu solder alloy. The glass transition temperature of these materials ranges from 130°C to 230°C. Thermomechanical properties, such as elastic modulus and thermal expansion coefficients, of the board materials vary considerably. These properties have a direct impact on the interconnect durability. In this paper, thermomechanical properties are experimentally determined and used for solder joint durability simulation. Two kinds of environmental loadings are simulated: temperature cycling and random vibration loading. The results show that PI board provides a better solder joint durability than FR4 and high TFR4 under temperature cycling conditions. PI assembly has better durability than FR4 assembly under random vibration. The paper also presents the effect of temperature on the vibration response of the FR4 printed circuit board assemblies. The understanding of these changes can contribute to the study on interconnect durability under combined temperature cycling and vibration loading conditions.
Starting Page	140
Ending Page	144
File Size	2608943
Page Count	5
File Format	PDF
ISBN	0780395530
DOI	10.1109/POLYTR.2005.1596504
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2005-10-23
Publisher Place	Poland
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Printed circuits Environmentally friendly manufacturing techniques Integrated circuit interconnections Assembly Temperature Soldering Lead Glass Thermomechanical processes Packaging coefficient of thermal expansion Printed circuit board solder joints lead-free FR4 Polyimide temperature cycling random vibration sinusoidal vibration glass transition temperature elastic modulus
Content Type	Text
Resource Type	Article

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