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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Wan, G.J. Leng, Y.X. Sun, H. Yang, P.Y. Chen, J.Y. Wang, J. Huang, N. |
| Copyright Year | 2003 |
| Description | Author affiliation: Sch. of Mater. Sci. & Eng., Southwest Jiaotong Univ., Chengdu, China (Wan, G.J.; Leng, Y.X.; Sun, H.; Yang, P.Y.; Chen, J.Y.; Wang, J.; Huang, N.) |
| Abstract | Summary form only given, as follows. Ti-O films have been shown to possess excellent blood compatibility based on our prior research work as well as that of other researchers. Some attempts have been taken to synthesize Ti-O films on cardiovascular implants to modify their surface properties. In this research, a DC Metal Vacuum Arc Deposition technique was used, with its advantages (such as good control of the sample composition and structure, high deposition efficiency, high adhesion, as well as good mechanical properties), to deposit Ti-O films on silicon wafers. Platelet adhesion tests were carried out for evaluation of the blood compatibility of the Ti-O films, the results show that the platelet adhesion behavior of the deposited Ti-O films is better than that of LTIC and naturally oxidized TiO/sub 2/, and samples deposited in higher vacuum (low O/sub 2/ pressure) are better than those deposited in poorer vacuum. Almost no platelet aggregation and pseudopodium have been observed on the best Ti-O film, while serious aggregation as well as pseudopodium was found on LTIC material, which has been clinically applied for cardiovascular artificial organs for decades. |
| Sponsorship | Plasma Sci. & Applications Committee of the IEEE Nucl. & Plasma Sci. Soc. Hanyang Univ. Japan Soc. Plasma Res. Assoc. Korea Atomic Energy Res. Inst. Korea Basic Sci. Inst. Korea Vacuum Soc |
| File Size | 103845 |
| File Format | |
| ISBN | 078037911X |
| ISSN | 07309244 |
| DOI | 10.1109/PLASMA.2003.1228831 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2003-06-05 |
| Publisher Place | South Korea |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Vacuum arcs Adhesives Blood Cardiology Implants Vacuum technology Mechanical factors Semiconductor films Silicon Testing |
| Content Type | Text |
| Resource Type | Article |
| Subject | Atomic and Molecular Physics, and Optics Condensed Matter Physics Electrical and Electronic Engineering |
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