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2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2012 19th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

18th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

2010 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits

2008 15th International Symposium on the Physical and Failure Analysis of Integrated Circuits

IPFA 2008 table of contents

Trends and requirements of future high-performance CMOS

Advance packaging requirements for next generation microprocessors

Scale, function and materials: debug and diagnosis in electronic device technology roadmap

Scan-based ATPG diagnostic and optical techniques combination: A new approach to improve accuracy of defect isolation in functional logic failure

Effect of Refractive Solid Immersion Lens parameters on the enhancement of laser induced fault localization techniques

Application of FIB circuit edit combined with TIVA in advanced failure analysis

Failure analysis enhancement by evaluating the Thermal Laser Stimulation impact on analog ICs

The helium ion microscope for high resolution imaging, materials analysis and FA applications

Time resolved determination of electrical field distributions within dynamically biased power devices by spectral EBIC investigations

Humidity-induced semiconductor device electrical reliability failures: Mechanism and wafer-level risk evaluation/ electrical screening-test proposal

A case study on different test screening techniques for ICS with high resistance vias interconnects issues

A novel ESD device structure with fully silicide process for mixed high/low voltage operation

Optimization on SCR device with low capacitance for on-chip ESD protection in UWB RF circuits

Using line-length effects to optimize circuit-level reliability

Statistical modeling of via redundancy effects on interconnect reliability

Effects of pulsed current on electromigration lifetime

TCAD solutions for submicron copper interconnect

Investigation on the mechanism of the leakage failure between poly gate and contact in subnano technology

Raman-IR micro-thermography tool for reliability and failure analysis of electronic devices

An application of C-AFM as a tool for SRAM soft single-column failure analysis in advanced HV technologies

Conductive Atomic Force Microscopy failure analysis for SOI devices

Advanced localization technique of failures in packages / IO-stages of chips using Vector Network Analyser

Device-level fault isolation of advanced flip-chip devices using scanning SQUID microscopy

Test structure failed node localization and analysis from die backside

Reliability of Cu pillar bump for flip chip and 3-D SiP

Case study of copper dendrite growth under HAST test

Effect of bonding pressure on the bond strengths of low temperature Ag-In bonds

Early whisker detection through intermetallic compound (IMC) grain size

IMC growth and DR4 open on TSOP package

Lid adhesive failure study for flip chip packaging

CAFM detection of resistive tungsten contacts in DRAM devices

Application of conductive atomic force microscopy to study the in-line electrical defects

Investigation of soft fail issue in sub-nanometer devices using nanoprobing technique

Failure analysis of 65nm technology node SRAM soft failure

A simple method for TEM sample preparation without carbon film background

Improved image processing to enhance thermal laser stimulation signal

Near-infrared spectroscopic photon emission microscopy of 0.13 μm silicon nMOSFETs and pMOSFETs

IC package inspection with nanofocus X-ray tubes and nanoCT

EMMI analysis on silicon solar cell

Backside GMR Magnetic Microscopy for flip chip and related microelectronic devices

Chemical and physical characterization techniques in highlighting intermetallic compound (IMC) formation

A novel pseudo tri-gate vertical MOSFET with source/drain tie

Simulation of the multi-source/drain SOI MOSFET

Stress-induced degradation in strain-engineered nMOSFETs

DIBL in short-channel strained-Si n-MOSFET

Influence of hydrogen annealing on NBTI performance

Reliability of ZrO stacked high-k dielectrics on Ge under dynamic and pulsed voltage stress

Trends in solar cell research

Au nanocrystal flash memory reliability and failure analysis

Characterization and modeling of program/erase induced device degradation in 2T-FNFN-NOR flash memories

The effect of band gap engineering of the nitride storage node on performance and reliability of charge trap flash

A novel dual-BBHH erasing scheme to improve endurance and retention performances for localized charge trapping memories

Study on SRAM soft failure using planar-view transmission electron microscopy techniques

Review of reliability issues in high-k/metal gate stacks

A new TDDB lifetime bi-model for eDRAM MIM capacitor with ZrO2 high-k dielectrics

A rigorous model for trapping and detrapping in thin gate dielectrics

The impact of gate dielectric nitridation methodology on NBTI of SiON p-MOSFETs as studied by UF-OTF technique

Trapping and de-trapping characteristics in PBTI and dynamic PBTI between HfO and HfSiON gate dielectrics

A study of NBTI in HfSiON/TiN p-MOSFETs using ultra-fast on-the-fly (UF-OTF) I technique

Nanoanalysis of high-k dielectrics on semiconductors

Physical characterization challenges in 45 nm technology node

Understanding Soft Defect Localization set-points for reducing cause-not-founds in integrated circuits

Gate oxide integrity failure caused by molybdenum contamination introduced in the ion implantation

Tool cleanliness characterization for improving productivity and yields

Studies and applications of standardless EDX quantification method in failure analysis of wafer fabrication

New models for interconnect failure in advanced IC technology

Interfacial characterization of ultra low-k film (kappa=2.55) with time of flight secondary ion mass spectrometry (TOF-SIMS)

Etching of copper in deionized water rinse

Current-induced breakdown of carbon nanofiber interconnects

Solderability and reliability of printed electronics

The device characteristics of partially undoped poly-silicon gate P-LDMOS power transistors

Hot carrier degradation in nanowire (NW) FinFETs

Degradation of metal-induced laterally crystallized n-type poly-Si thin-film transistors under dynamic voltage stress

Failure analysis matrix of light emitting diodes for general lighting applications

Failure site isolation on passive RFID tags

2007 14th International Symposium on the Physical and Failure Analysis of Integrated Circuits

2006 13th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of the 12th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2005. IPFA 2005.

Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2004 (IEEE Cat. No.04TH8743)

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

Proceedings of the 9th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.02TH8614)

Proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2001 (Cat. No.01TH8548)

Proceedings of the 1999 7th International Symposium on the Physical and Failure Analysis of Integrated Circuits (Cat. No.99TH8394)

Proceedings of the 1997 6th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits

Trends in solar cell research

Content Provider	IEEE Xplore Digital Library
Author	Mertens, R.
Copyright Year	2008
Description	Author affiliation: IMEC, K.U.Leuven, Leuven (Mertens, R.)
Abstract	Photovoltaics (PV) is becoming an important industrial product. Today the PV market is dominated by wafer based crystalline Si cells. The cost of these cells will decrease in the future by using thinner wafers and devices with higher conversion efficiency. It is expected that nanotechnology will play an important role in the longer run in order to further lower the PV cost. PV can also profit from cross fertilization with micro- and nano-electronics. PV modules have shown to be very reliable in the field but more reliability research is needed in fields such as ultra-thin Si wafer based cells, concentrator PV and organic solar cells.
Starting Page	1
Ending Page	5
File Size	748873
Page Count	5
File Format	PDF
ISBN	9781424420391
DOI	10.1109/IPFA.2008.4588189
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Silicon Photovoltaic cells Junctions Excitons Nanotechnology Photovoltaic systems Materials
Content Type	Text
Resource Type	Article

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