NDLI: Early whisker detection through intermetallic compound (IMC) grain size

Content Provider	IEEE Xplore Digital Library
Author	Tan, Y.Y. On, D. Krishnan, J.
Copyright Year	2008
Description	Author affiliation: Infineon Technol. (M) Sdn. Bhd., Batu Berendam (Tan, Y.Y.; On, D.; Krishnan, J.)
Abstract	Sn whisker has been a concern in the semiconductor industry. The whiskers will grow within few hours to months with a diameter of 1 micron up to a length of several millimeters. It is difficult to access the whisker impact for Sn plated lead frame. There are no test acceleration factors that can be established to promote a faster growth rate for the whisker. The countermeasure that generally practices is post-bake at 150degC for 1 hour on product. In this paper, an early whisker detection method is introduced. It is observed that the intermetallic compound (IMC) for Sn plated copper lead frame will be developed with different IMC grain size at different annealing hours. The IMC grain size will be developed along the grain boundaries of the Sn deposited and at the Sn-Cu interface layer. It is shown that the larger the IMC grain size will results in reduction of the whisker growth. An IMC grain size grading was developed and it can be used as an early detection method to judge on whisker impact.
Starting Page	1
Ending Page	4
File Size	1225028
Page Count	4
File Format	PDF
ISBN	9781424420391
DOI	10.1109/IPFA.2008.4588169
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-07-07
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Tin Grain size Annealing Grain boundaries Lead Copper Intermetallic
Content Type	Text
Resource Type	Article

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