NDLI: The application of flip chip bonding technology using anisotropic conductive film to the mobile communications terminals

Content Provider	IEEE Xplore Digital Library
Author	Torii, A. Takizawa, M. Sawano, M.
Copyright Year	1998
Description	Author affiliation: Toshiba Corp., Tokyo, Japan (Torii, A.)
Abstract	In the field of mobile communications systems, the terminals have been downsized and given higher functions very rapidly. High-density surface mount technology is therefore required. For this reason, flip chip bonding (FCB) technology, which is the ultimate high-density surface mount technology at present, has been developed in Toshiba's Hino Works. This technology has been developed by using gold ball bumps and anisotropic conductive film (ACF). Bondability and reliability after FCB and after reflow soldering had already been confirmed for experimental materials. As the next items in the development, bondability and reliability after reflow soldering as well as after FCB were confirmed on the products. Also, the bonding process for the products was established. Moreover, mass production technology using the FCB method has been developed with fully automatic bonding machines and applied to the LCD module for a pager, which is one of the mobile communications terminals.
Starting Page	94
Ending Page	99
File Size	641597
Page Count	6
File Format	PDF
ISBN	0780350901
DOI	10.1109/IEMTIM.1998.704531
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-04-15
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Organizing Committee
Subject Keyword	Flip chip Bonding Anisotropic magnetoresistance Surface-mount technology Mobile communication Reflow soldering Gold Anisotropic conductive films Materials reliability Conducting materials
Content Type	Text
Resource Type	Article

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The Application Of Flip Chip Bonding Technology To The Mobile Communications Terminals

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ACF (Anisotropic Conductive Film) Batch Bonding Connection changing Flip Chip Bonding technology

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The application of flip chip bonding technology using anisotropic conductive film to the mobile communications terminals

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