NDLI: Anisotropic conductive paste available for flip chip

Content Provider	IEEE Xplore Digital Library
Author	Kishimoto, Y. Hanamura, K.
Copyright Year	1998
Description	Author affiliation: Toshiba Chem. Corp., Kawasaki, Japan (Kishimoto, Y.)
Abstract	This report aims to explain the applications, concepts, and properties of ACP (anisotropic conductive paste), which was developed for flip chip joining. ACP is a nonsolvent, one-pack-type of liquid connection material. It is composed structurally of fine conductive particles diffused in liquid thermosetting resin. With this paste thermally crimped between two electrodes to provide physical bonding, electrodes that are located opposing or adjacent to each other are provided with conductivity or insulation, respectively. ACP is outstanding in terms of hardening time, requiring only a few seconds at 200/spl deg/C or above, thus assuring high industrial productivity. Also, it is highly stable in long-term storage extending over a few months. Furthermore, the paste's conductivity and insulation properties mean that it can successfully provide flip chip connection with assured reliability. Mounting does not involve the use of lead or flux, and thus the paste is environmentally friendly. ACP is easy to handle and outstanding in terms of productivity, and can thus be recommended as a mounting method with a wide scope for application.
Starting Page	137
Ending Page	143
File Size	901137
Page Count	7
File Format	PDF
ISBN	0780349342
DOI	10.1109/ADHES.1998.742016
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-09-30
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Anisotropic magnetoresistance Flip chip Bonding Electrodes Lead Insulation Soldering Chemicals Conducting materials Resins
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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