NDLI: Development of heat dissipation structure for face-down bonded devices

Content Provider	IEEE Xplore Digital Library
Author	Nakakuki, K. Takahashi, Y. Iguchi, Y. Anasako, K. Shimamura, H.
Copyright Year	1998
Description	Author affiliation: Oki Electr. Ind. Co. Ltd., Tokyo, Japan (Nakakuki, K.)
Abstract	We developed a heat dissipation structure for face-down bonded surface acoustic wave (SAW) filter packages. This structure enables compact packages at low cost. Heat dissipation from the transmission (Tx) SAW filter and filter sealing are important factors in enhancing package reliability. Tx and reception (Rx) SAW filters were bonded on a printed wiring board (PWB) with a branching circuit, and the filters were sealed with a metallic lid using conductive adhesive. High thermal conductivity adhesive was used to fill between the Tx SAW filter and the metallic lid, enabling the heat of the Tx SAW filter to be dissipated. The filter properties of the package using this high thermal conductivity adhesive were not changed after 500 hour operation with 5 W input RF signals. Results following the performance of thermal shock tests also confirmed characteristics indicating an extremely tight seal, with a rate of helium leakage of only 10/sup -8/ atm/spl middot/cc/s. Thus, as indicated in detail by these results, we concluded that the structure which we developed has been proven to be suitable for application to SAW filter packages.
Starting Page	337
Ending Page	342
File Size	622352
Page Count	6
File Format	PDF
ISBN	0780350901
DOI	10.1109/IEMTIM.1998.704671
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-04-15
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Organizing Committee
Subject Keyword	Bonding Packaging SAW filters Thermal conductivity Surface acoustic waves Acoustic waves Costs Wiring Circuits Conductive adhesives
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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