NDLI: Damage and fracture evaluation in microelectronic assemblies by FEA and experimental investigations

Content Provider	IEEE Xplore Digital Library
Author	Auersperg, J. Winkler, Th. Vogel, D. Michel, B.
Copyright Year	1998
Description	Author affiliation: Dept. of Mech. Reliability & Micro Mater., Fraunhofer Inst. for Reliability & Microintegration Berlin, Germany (Auersperg, J.)
Abstract	Thermomechanical reliability of electronic packaging such as flip chip and chip scale packaging is most important for adoption of these technologies in industrial applications. However, various kinds of inhomogeneities, localized stresses and thermal mismatch between several components lead to interface delaminations, chip cracking and solder interconnect fatigue. Nonlinear finite element simulations which respect the nonlinear, temperature and rate dependent behaviour of different materials used (metals, polymeric and solder materials) and experimental investigations have been used for failure analysis. The development and application of failure models (e.g. thermal fatigue, lifetime prediction by Coffin-Manson type equations, integral fracture mechanics approaches such as J-, J/spl circ/-, and /spl Delta/T*-integral, and evaluation of critical regions) is explained. The influence of the scatter of some model parameters is investigated by probabilistic failure concepts. Additionally, simulation of damage growth in solder interconnects by an automatic adaptive finite element technique is performed using inherent local damage models to validate crack and damage models used. Consequently, some results have been compared to micrographs from damaged interconnects and to strain measurement results obtained by the microDAC measurement method. The application of those combined investigations should help further understanding of failure mechanisms especially in solder joints, and should support further applications for enhancing the thermomechanical reliability of advanced electronic assemblies.
Starting Page	290
Ending Page	295
File Size	756772
Page Count	6
File Format	PDF
ISBN	0780350901
DOI	10.1109/IEMTIM.1998.704662
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-04-15
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Organizing Committee
Subject Keyword	Microelectronics Assembly Thermomechanical processes Thermal stresses Fatigue Finite element methods Inorganic materials Failure analysis Integral equations Strain measurement
Content Type	Text
Resource Type	Article

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