NDLI: A Novel Cell Manipulation Device for Cytoplasmic Transplantation

Content Provider	IEEE Xplore Digital Library
Author	Kimura, Y. Gel, M. Techaumnat, B. Kurosawa, O. Tsuda, K. Oana, H. Kotera, H. Tada, T. Washizu, M.
Copyright Year	2008
Description	Author affiliation: Dept. of Mech. Eng., Kyoto Univ., Kyoto (Tsuda, K.) \|\| Dept. of Bioeng., Univ. of Tokyo, Tokyo (Kimura, Y.; Washizu, M.) \|\| Dept. of Mech. Eng., Univ. of Tokyo, Tokyo (Gel, M.) \|\| ASTEM Res. Inst., Kyoto (Kurosawa, O.) \|\| Dept. of Electr. Eng., Chulalongkorn Univ., Bangkok (Techaumnat, B.) \|\| JST, CREST, Suita (Oana, H.; Kotera, H.; Tada, T.)
Abstract	We present novel cell manipulation devices for cytoplasmic transplantation without mixing of genomes. The device consists of two channels separated by an insulating wall on which an orifice is fabricated. The orifice was utilized for a high-yield electrofusion between donor and recipient cells, and physical removal of the nucleus belonging to the donor. A donor and a recipient cell for the transplantation were first brought into contact through an orifice by dielectrophoresis (DEP). Then, voltage pulse was applied to induce cell membrane breakdown. The electric field lines are constricted at an orifice so that the membrane breakdown occurs exclusively at an orifice, inducing cell fusion at an orifice. After the cell fusion, the fusant was taken-out toward the recipient side by applying a pressure difference. Because the orifice was small enough to prevent the donor nucleus from being taken-out together, only the cytoplasm was transplanted. We also demonstrate feasibility of parallel processing of the transplantations using a device which has an array of orifice on an insulating sheet. A large number of cells were successfully fusioned in parallel by using the orifice-sheet. The parallel cytoplasmic transplantation would be realized by making the size of orifices smaller.
Starting Page	196
Ending Page	201
File Size	4986927
Page Count	6
File Format	PDF
ISBN	9781424429189
DOI	10.1109/MHS.2008.4752449
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-11-06
Publisher Place	Japan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Orifices Insulation Breakdown voltage Biomembranes Genomics Bioinformatics Dielectrophoresis Cells (biology) Electric breakdown Parallel processing
Content Type	Text
Resource Type	Article

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