NDLI: Non-contact batch micro-assembly by centrifugal force

Content Provider	IEEE Xplore Digital Library
Author	Lai, K.W.C. Hui, A.P. Li, W.J.
Copyright Year	2002
Description	Author affiliation: Center for Micro & Nano Syst., Chinese Univ. of Hong Kong, China (Lai, K.W.C.)
Abstract	Due to the minute scale of MEMS, inertia forces are often neglected. However, we prove that these forces can be significant even if a microstructure's mass is <1 /spl mu/g (a 250 /spl mu/m /spl times/ 100 /spl mu/m mass with MUMPs poly1, poly2, and Au layers). We demonstrate that at this scale, mass inertia force can overcome surface forces and be used for non-contact self-assembly of MEMS structures. A centrifugal force was applied to hinged MUMPs#31 structures, causing these structures to self-assemble by rotating themselves 90/spl deg/ out of substrate plane and to lock themselves automatically to designed latches. This batch-assembly technique is very fast, low-cost, non-contact, and non-destructive. Moreover, we have successfully characterized the centrifugal forces needed to assemble these microstructures by integrating sensors on the same MUMPs chips to provide wireless signals that relate to the dynamic behavior of the microstructures. This is a very important result in terms of making feasible quantitative analyses of surface forces acting on surface micromachined MEMS devices.
Sponsorship	IEEE
Starting Page	184
Ending Page	187
File Size	482157
Page Count	4
File Format	PDF
ISBN	0780371852
ISSN	10846999
DOI	10.1109/MEMSYS.2002.984235
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-01-24
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microstructure Micromechanical devices Fasteners Friction Stress Microelectromechanical devices Assembly systems Gravity Mirrors Gold
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

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