NDLI: Selective plating of nickel ceramic composite films for MEMS applications

Content Provider	IEEE Xplore Digital Library
Author	Teh, K.S. Cheng, Y.T. Sambucetti, C.
Copyright Year	2002
Description	Author affiliation: Dept. of Mech. Eng., California Univ., Berkeley, CA, USA (Teh, K.S.)
Abstract	A simple, selective and CMOS-compatible deposition method for nickel ceramic composite films has been demonstrated. Using an electroless plating technique, two types of nickel ceramic composite thin films, nickel-cordierite and nickel-iron (II, III) oxide, have been successfully deposited and characterized on silicon substrates. The incorporation of an appropriate amount of cordierite particles into a nickel matrix is shown to significantly reduce the thermal expansion mismatch between nickel and silicon, yet maintain the Young's modulus, Berkovich hardness and electrical resistivity at approximately 167 GPa, 7.6 GPa and 9.4 /spl mu//spl Omega/-cm, respectively, values which correspond closely to electroless nickel. On the other hand, the addition of iron (II, III) oxide instead of cordierite can also increase the coercivity of electroless nickel up to 170 Oe, thereby significantly enhancing its ferromagnetic properties.
Sponsorship	IEEE
Starting Page	384
Ending Page	387
File Size	492427
Page Count	4
File Format	PDF
ISBN	0780371852
ISSN	10846999
DOI	10.1109/MEMSYS.2002.984283
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2002-01-24
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Nickel Ceramics Micromechanical devices Silicon Semiconductor thin films Sputtering Thermal expansion Thermal resistance Electric resistance Iron
Content Type	Text
Resource Type	Article
Subject	Condensed Matter Physics Electronic, Optical and Magnetic Materials Mechanical Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

High-Rate Sputtering of Thick PZT Layers for MEMS Actuators

MEMS flow sensors for nano-fluidic applications

TiNi (shape memory) films silicon for MEMS applications

Effect of the substrates on mechanical and electrical properties of Pb(Zr0.52Ti0.48)O3 thin films for MEMS applications

Miniature SAW Device for RF-Wireless Applications Using MEMS Technology

Development of SiCN ceramic thermal actuators

A MEMS mid-infrared thermal source for NDIR gas analyzers

Wafer-level mechanical characterization of silicon nitride MEMS

A Multiple Degrees of Freedom Electrothermal Actuator for a Versatile MEMS Gripper

Selective plating of nickel ceramic composite films for MEMS applications

Similar Documents

High-Rate Sputtering of Thick PZT Layers for MEMS Actuators

MEMS flow sensors for nano-fluidic applications

TiNi (shape memory) films silicon for MEMS applications

Effect of the substrates on mechanical and electrical properties of Pb(Zr0.52Ti0.48)O3 thin films for MEMS applications

Miniature SAW Device for RF-Wireless Applications Using MEMS Technology

Development of SiCN ceramic thermal actuators

A MEMS mid-infrared thermal source for NDIR gas analyzers

Wafer-level mechanical characterization of silicon nitride MEMS

A Multiple Degrees of Freedom Electrothermal Actuator for a Versatile MEMS Gripper

Selective plating of nickel ceramic composite films for MEMS applications