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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jun Yang Yi Shih Lin Yang, S.F. Yi Huang Qun Shao Hongtao Liu |
| Copyright Year | 2015 |
| Description | Author affiliation: Semicond. Manuf. Int. (Shanghai) Corp., Shanghai, China (Jun Yang; Yi Shih Lin; Yang, S.F.; Yi Huang; Qun Shao; Hongtao Liu) |
| Abstract | There are increasing new needs for advanced process control (APC) from chemical mechanical polishing (CMP) process along with the technology nodes advancing to 28nm and below. Besides traditional applications for wafer to wafer and batch to batch thickness variation reduction, and feed-forward based on incoming thickness/depth, the other new needs include within wafer uniformity control based on consumable counts and incoming profile, preventing polishing rate from dropping due to disk and pad deteriorating etc. This paper discusses those APC applications for CMP processes and along with important features which advanced APC software should equip with. |
| Starting Page | 1 |
| Ending Page | 3 |
| File Size | 502288 |
| Page Count | 3 |
| File Format | |
| ISBN | 9781479972418 |
| ISSN | 21582297 |
| DOI | 10.1109/CSTIC.2015.7153421 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2015-03-15 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Partition Process control Advanced process control Tuning Radio access networks Semiconductor device modeling Run to run control Profile control Production Software Safety guarding features Safety Chemical mechanical polishing |
| Content Type | Text |
| Resource Type | Article |
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