NDLI: Numerical analysis on the liquid cooling of microchannel heatsink with phase change material

Content Provider	IEEE Xplore Digital Library
Author	Han-Chieh Chiu Ren-Horng Hsieh Jhih-Teng Yao Jer-Huan Jang
Copyright Year	2015
Description	Author affiliation: Dept. of M.E., Taipei Chengshih U. of Sci. & Tech., Taipei, Taiwan (Han-Chieh Chiu; Ren-Horng Hsieh; Jhih-Teng Yao) \|\| Dept..of M.E./BRCGE, Ming Chi U. of Tech., Taipei, Taiwan (Jer-Huan Jang)
Abstract	In this study, a microchannel heatsink with working fluid containing phase change material has been investigated numerically. The addition of phase change material in working fluid is to increase the heat transfer rate during cooling process. Commercial software ANSYS Fluent 15.0 is utilized to study the thermal resistance of the microchannel heatsink. Properties of working fluid with phase change material are with mass-averaged values. The numerical model for the phase change material used the latent heat as a function of heat capacity during phase change. This concept is modeled with user defined function in the simulation. The effects of microchannel geometry and the driven pressure difference between the entrance and exit of the heatsink on heat transfer performance are studied as well. The microchannel width varies in hundred micrometers with 2mm in height; the cross-sectional porosity of the fin array ranges from 0.6 to 0.7. Concentration of the phase change material in the working fluid is also a parameter in the investigation, ranging from 0% to 10%. The driven pressure difference of the working fluid is less than 30cm water head. The fin array covers an area of $1cm^{2},$ and the power supply is 60W, such that the heat flux is $0.6MW/m^{2}.$
Starting Page	1
Ending Page	3
File Size	378328
Page Count	3
File Format	PDF
ISBN	9781479972418
ISSN	21582297
DOI	10.1109/CSTIC.2015.7153444
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-03-15
Publisher Place	China
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Phase change materials Cooling Thermal resistance Heating Pumps Finite element analysis
Content Type	Text
Resource Type	Article

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