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Content Provider | IEEE Xplore Digital Library |
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Author | Huang-Yu Chen Szu-Jui Chou Sheng-Lung Wang Yao-Wen Changt |
Copyright Year | 2007 |
Description | Author affiliation: Nat. Taiwan Univ., Taipei (Huang-Yu Chen; Szu-Jui Chou) |
Abstract | As nanometer technology advances, the post-CMP dielectric thickness variation control becomes crucial for manufacturing closure. To improve CMP quality, dummy feature filling is typically performed by foundries after the routing stage. However, tilling dummy features may greatly degrade the interconnect performance and lead to explosion of mask data. It is thus desirable to consider wire-density uniformity during routing to minimize the side effects from aggressive post-layout dummy filling. In this paper, we present a new full-chip grid-based routing system considering wire density for reticle planarization enhancement. To fully consider wire distribution, the router applies a novel two-pass, top-down planarity-driven routing framework, which employs a new density critical area analysis based on Voronoi diagrams and incorporates an intermediate stage of density-driven layer/track assignment based on incremental Delaunay triangulation. Experimental results show that our methods can achieve more balanced wire distribution than state-of-the-art works. |
Starting Page | 831 |
Ending Page | 838 |
File Size | 2611680 |
Page Count | 8 |
File Format | |
ISBN | 9781424413812 |
ISSN | 10923152 |
DOI | 10.1109/ICCAD.2007.4397368 |
Language | English |
Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Publisher Date | 2007-11-04 |
Publisher Place | USA |
Access Restriction | Subscribed |
Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
Subject Keyword | Wire Routing Filling Dielectrics Thickness control Manufacturing Foundries Degradation Explosions Planarization |
Content Type | Text |
Resource Type | Article |
Subject | Computer Graphics and Computer-Aided Design Computer Science Applications Software |
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