NDLI: A comparative study of the relative performances of the sinter-silver die attach materials

Content Provider	IEEE Xplore Digital Library
Author	Qi, Quan
Copyright Year	2015
Description	Author affiliation: Intel Communications and Device Group, Intel America, Inc. 2111 NE 25 Ave., Hillsboro, OR 97124 (Qi, Quan)
Abstract	Die attach materials play an important role in meeting the demanding thermal management requirements of high power devices. Conventionally, silver filled conductive epoxy materials provide low cost solutions and Au-Sn soldering solution meet the higher power application needs. While epoxy based die attach materials have seen widespread use and continued performance improvement over years, contact thermal resistance at the interface often presents a challenge to achieving the claimed thermal performance of the bulk materials; on the other hand, soldering die attach requires higher reflow temperature than many applications can endure and, in some cases, soldering die attach performance is still insufficient to meet the ever-demanding high power applications. In addition, the leading Pb-free soldering die attach, Au-Sn, is costly and should be replaced if possible. There have been significant development of sinter-silver (S-Ag) die attach solutions in recently years. Several materials vendors announced new product offerings with different claims of performances. It is with this in mind that we present a study of the relative performances of several S-Ag die attach materials using a standard QFN package to: 1. Quantify the relative thermal performances of different S-Ag die attach materials 2. Benchmark the results against Ag-filled epoxy die attach 3. Benchmark the results against pressure-assisted S-Ag die attach 4. Assess the relative reliability performance with accelerated stress tests 5. Perform F/A analysis to understand the failure mode of the S-Ag die attaches To remove ambiguity of the thermal measurement results, a CMOS thermal test die with uniform heaters and sensitive junction temperature detection diodes is assembled onto a QFN lead frame with S-Ag die attach materials from different vendors, along with some Ag-filled epoxy and a pressure sinter-Ag die attach materials. To ensure accuracy of the thermal measurements; a transient thermal measurement method based on Mentor Graphics' t3Tster test system was used, which allows capture of the die attach thermal resistance and the identification of the thermal conductivities of the S-Ag die attach. The obtained results are benchmarked against known materials properties and compared with vendor's datasheet. To help assess the relative reliability and thermal stabilities of these die attach materials, the assembled QFN's were subjected to MSL3 pre-conditioning and accelerated thermal cycling test (ACT) between −55 to 125C and then thermally measured again. Comparisons between the initial and post-stress thermal measurement results provide insight and help understand any potential thermal performance change as well as reliability implications. This is the first systematical study of its kind to give a side-by-side comparison of the performance of different S-Ag die attach materials.
Starting Page	1
Ending Page	4
File Size	1455203
Page Count	4
File Format	PDF
e-ISBN	9781467372695
DOI	10.1109/EPTC.2015.7412418
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-12-02
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Microassembly Electronic packaging thermal management Thermal resistance Temperature measurement Transient analysis Stress
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

High temperature die-attach effects on die stresses

Effects of die-attach materials on the optical durability and thermal performances of HP-LED

Thermal performance and reliability assessment of nano-sintered silver die attach materials

Thermal simulation study of die attach delamination effect on TQFP package thermal resistance

Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices

Thermal management of high power LEDs: Impact of die attach materials

Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package

Low stress polymer die attach adhesive for plastic packages

High thermal conductive die attach material process characterization challenges

A comparative study of the relative performances of the sinter-silver die attach materials

Similar Documents

High temperature die-attach effects on die stresses

Effects of die-attach materials on the optical durability and thermal performances of HP-LED

Thermal performance and reliability assessment of nano-sintered silver die attach materials

Thermal simulation study of die attach delamination effect on TQFP package thermal resistance

Transient Liquid Phase Die Attach for High-Temperature Silicon Carbide Power Devices

Thermal management of high power LEDs: Impact of die attach materials

Impact of the die attach process on power & thermal cycling for a discrete style semiconductor package

Low stress polymer die attach adhesive for plastic packages

High thermal conductive die attach material process characterization challenges

A comparative study of the relative performances of the sinter-silver die attach materials