NDLI: Interfacial reaction and reliability of high temperature die attach solders for power electronics

Content Provider	IEEE Xplore Digital Library
Author	Bum, Lee Jong Yuan, Hwang How Chih, Pan Wei Daniel, Rhee Min Woo
Copyright Year	2015
Description	Author affiliation: Heraeus Materials Singapore Pte Ltd, Global Business Unit Heraeus Electronics. 10 Ang Mo Kio Street 65, Singapore 569059 (Chih, Pan Wei) \|\| Institute of Microelectronics, A∗STAR (Agency for Science, Technology and Research) 11 Science Park Rd, Singapore Science Park II, Singapore 117685 (Bum, Lee Jong; Yuan, Hwang How; Daniel, Rhee Min Woo)
Abstract	Lead-free solder alloys for high temperature applications is required to meet increasing demands for reliable replacements for lead-based alloys. Especially, high temperature solder is required for bonding in power electronics packages where first bonding on a lead-frame is performed at a temperature of about 330 °C. In this study, the SiC based TO-220 power package was developed by applying high temperature endurable material sets which can endure over 220°C device junction temperature. The interfacial reaction and reliability of SiC die attachment on and Ni plated lead frames using Zn-Al based solder was investigated. Zn-Al-Ge solder alloy showed good temperature tolerance after temperature cycle (TC), high temperature storage test whereas Zn-Al-Ge-Mg solder alloy showed failures after TC test.
Starting Page	1
Ending Page	5
File Size	4674875
Page Count	5
File Format	PDF
e-ISBN	9781467372695
DOI	10.1109/EPTC.2015.7412304
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-12-02
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	High-temperature superconductors Image edge detection Reliability Lead Silicon carbide Bonding
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
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4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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