NDLI: Advanced wire bonding technology for Ag wire

Content Provider	IEEE Xplore Digital Library
Author	Shah, Aashish Rockey, Thomas Xu, Hui Qin, Ivy Jie, Wu Yauw, Oranna Chylak, Bob
Copyright Year	2015
Description	Author affiliation: Kulicke & Soffa Pte. Ltd., 23A Serangoon North Ave 5 #01-01, Singapore 554369 (Jie, Wu; Yauw, Oranna) \|\| Kulicke & Soffa, Inc, 1005 Virginia Drive, Fort Washington, PA, 19034, U.S.A (Shah, Aashish; Rockey, Thomas; Xu, Hui; Qin, Ivy; Chylak, Bob)
Abstract	With the introduction and proliferation of Cu wire bonding, the cost of wire bonding packages is greatly reduced compared to traditional Au wire bonding. Wire bonding is still the most popular interconnect technology and the work horse of the industry. Technology development and innovation in wire bonding has provided new packaging solutions that improve performance and reduce the cost. This paper reviews the pros and cons of each bonding wire type that is being used for ball bonding including Au, Cu, and Ag wire. Although Cu wire is by far the cheapest bonding wire, in certain cases Cu wire is not a viable solution due to either the lack of advanced Cu wire equipment and process or the special requirements of the package. For example, Cu wire bonding has challenges with memory devices that require low loops and thin overhang die. In this case for memory devices, Ag wire is a good alternative that can provide significant cost reduction. This paper further examines the challenges and solutions for Ag wire bonding process including Free Air Ball (FAB) formation, the 1st bond and the 2nd bond. The key developments in ball bonding equipment, process and material to overcome these challenges are discussed. We studied the FAB formation process and studied the effect of cover gas system design, EFO (Electronic Flame Off) current, EFO gap, and other factors that affect the ball formation process. We demonstrate fine pitch capability of Ag wire bonding including 1st bond and 2nd bond using 0.6 mil Ag wire. Both forward bonding processes as well as SSB (Standoff Stitch Bond) are studied using new response based processes. The different wire alloys from 87% Ag to 97% Ag are also studied and compared in order to understand the differences in wire performance.
Starting Page	1
Ending Page	8
File Size	10501268
Page Count	8
File Format	PDF
e-ISBN	9781467372695
DOI	10.1109/EPTC.2015.7412367
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2015-12-02
Publisher Place	Singapore
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Wires Bonding Gold Packaging Oxidation
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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