NDLI: High resolution microstructural investigation of leadfree Aluminium-Germanium and Aluminum-Germanium-Copper alloys for high temperature silicon die attach

Content Provider	IEEE Xplore Digital Library
Author	Klengel, S. Bottge, B. Petzold, M. Schneider, W.
Copyright Year	2011
Description	Author affiliation: Microelectronic Packaging GmbH, Grenzstrasse 22, 01109 Dresden, Germany (Schneider, W.) \|\| Fraunhofer Institute for Mechanics of Materials, Walter-Hülse-Straße 1, 06120 Halle, Germany (Klengel, S.; Bottge, B.; Petzold, M.)
Abstract	Due to the RoHS and WEEE legislative requirements the implementation of lead free solder material is of prior significance in electronic manufacturing. As a consequence, many efforts have been started in order to adapt the soldering technology as well as to provide adequate equipment and materials. While European RoHS regulations currently exempt high Pb solders used as component solders and die attaches for automotive and other high temperature applications, there is a strong drive to find Pb-free alternatives for these high temperature electronic applications, as well. The development of lead-free solder materials with improved reliability properties requires a detailed understanding of the microstructure and thermal behavior. Aluminium-Germanium and Aluminum-Germanium-Copper alloys are described in literature as possible alternative solder materials for high temperature silicon die attach. However, no micro structural or process properties are released. In this study, DSC measurements will be performed to analyze the melting point of the different alloys and the crystallization behaviour. High resolution micro structural analyses will be shown at Al-Ge and Al-Ge-Cu alloys in initial condition and after melting processes. Using Focussed Ion Beam techniques (FIB) and Scanning Electron Microscopy (SEM) the alloys will be analyzed in delivery condition and after defined temperatures. Additionally the wetting behaviour of the two alloys will be described for different surfaces. Summarized this study gives a comprehensive knowledge of microstructural phenomena for the specific Aluminium-Germanium and Aluminum-Germanium-Copper alloys.
Starting Page	1
Ending Page	5
File Size	2442786
Page Count	5
File Format	PDF
ISBN	9781467306942
e-ISBN	9780956808608
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2011-09-12
Publisher Place	United Kingdom
Access Restriction	Subscribed
Rights Holder	IMAPS
Subject Keyword	power application Germanium Silicon AlGe50 AlGe44Cu0.8 die attach Reliability
Content Type	Text
Resource Type	Article

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