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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Jong-Min Yook Dong-Su Kim Jun-Chul Kim |
| Copyright Year | 2013 |
| Description | Author affiliation: Packaging Res. Center, Korea Electron. Technol. Inst., Seongnam, South Korea (Jong-Min Yook; Dong-Su Kim; Jun-Chul Kim) |
| Abstract | In this paper, a low-cost interposer technology is introduced which is a combination of PCB laminations and semiconductor thin-film processes. In advance, thin-film MIM capacitors are realized on the silicon surface by using standard thin-film process. After then, organic lamination and laser via drilling processes are used to make multi-layer signal and interconnections. Due to dual-side lamination process, the interposer has a symmetric structure and there are no warpages as increment of the number of signal layers. The fabricated interposer has an only 240 μm thickness and it has more than 8 metal layers. To demonstrate the interposer technology, a RF FEM is designed and realized by using the technology. In this module, thin film IPDs (Integrated Passive Devices) such as 2.45 GHz BPF and Balun are integrated in the front-side of the interposer, and a SPDT switch and 0603 chip capacitors are mounted on the back-side of the interposer. |
| Sponsorship | IEEE Singapore Sect. |
| Starting Page | 752 |
| Ending Page | 755 |
| File Size | 1030626 |
| Page Count | 4 |
| File Format | |
| e-ISBN | 9781479928347 |
| DOI | 10.1109/EPTC.2013.6745821 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-12-11 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Radio frequency Lamination Silicon Finite element analysis Band-pass filters Impedance matching Substrates |
| Content Type | Text |
| Resource Type | Article |
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