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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Bosman, E. Kaur, K.S. Missinne, J. Van Hoe, B. Van Steenberge, G. |
| Copyright Year | 2013 |
| Description | Author affiliation: Centre for Microsyst. Technol., Ghent Univ., Zwijnaarde, Belgium (Bosman, E.; Kaur, K.S.; Missinne, J.; Van Hoe, B.; Van Steenberge, G.) |
| Abstract | This paper presents two solutions to achieve efficient optical coupling between vertical cavity surface emitting lasers and planar optical waveguides, by minimizing the free space optical path length. One approach is based on embedding of optoelectronic chips in polymer layers, and the other approach on flip-chip assembly using micro-bumps. These micro-bumps are defined by laser-induced-forward-transfer (LIFT), a technique in which the bumping material can be transferred from a donor carrier to the waveguiding substrate. In both cases, out-of-plane bending of the light is accomplished by using a 45 degrees micro-mirror interface. |
| Sponsorship | IEEE Singapore Sect. |
| Starting Page | 625 |
| Ending Page | 629 |
| File Size | 2905393 |
| Page Count | 5 |
| File Format | |
| e-ISBN | 9781479928347 |
| DOI | 10.1109/EPTC.2013.6745795 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-12-11 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Optical fibers Vertical cavity surface emitting lasers Couplings Polymers Optical coupling Optical device fabrication |
| Content Type | Text |
| Resource Type | Article |
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