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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Roy, R. |
| Copyright Year | 2013 |
| Description | Author affiliation: Rudolph Technol., Bloomington, MN, USA (Roy, R.) |
| Abstract | The trend towards 3D stacking and Cu Pillar bumping has significantly altered the requirements for manufacturing tools in the back-end. Techniques and processes are beginning to resemble the front-end of 20 years ago but with updated and more affordable cost-of ownership capabilities. As an example, steppers would have been unheard of in the back-end. Today steppers are critical to achieve yield for devices ranging from fan-out wafer level chip scale packaging to Cu Pillar bumping. Re-distribution layer pitch has shrunk dramatically over the last few years, customers are demanding less than 5μm spacing and 5μm width. It is impossible to maintain effective CD over a 300mm wafer without a stepper on a three layer process. On wafer requirements, 0.5μm resolution inspection was state of the art 25 years ago. Today, fine pitch Cu Pillar is driving inspection of Cu bumps at similar resolution but at a significantly higher throughput and a much lower Cost-of-ownership (COO). Other traditional Front-end capabilities such as Metrology and Advanced Process Control (APC) that are being adopted by the back-end will also be discussed. |
| Sponsorship | IEEE Singapore Sect. |
| Starting Page | 520 |
| Ending Page | 523 |
| File Size | 724488 |
| Page Count | 4 |
| File Format | |
| e-ISBN | 9781479928347 |
| DOI | 10.1109/EPTC.2013.6745774 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2013-12-11 |
| Publisher Place | Singapore |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Metrology Packaging Blades Metals Inspection Lithography Films Advanced Process Control Assembly Advanced Packaging Bumping fine pitch Copper pillar TSV 3D Packaging Stepper Wafer Inspection |
| Content Type | Text |
| Resource Type | Article |
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