NDLI: Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

Content Provider	IEEE Xplore Digital Library
Author	Takyi, G. Ekere, N.N. Philpott, J.D. Snowdon, K.G. Tanner, C.G.
Copyright Year	1998
Description	Author affiliation: Electron Manuf. Group, Salford Univ., UK (Takyi, G.)
Abstract	The global restrictions on the use of chemicals that emit volatile organic compounds (VOC), such as fluxes, has prompted the electronics industry to evaluate alternative methods to flux application. In this paper, the soldering performance of plasma treated hot air solder level (HASL) finish PCBs in nitrogen and air atmospheres have been evaluated using the wetting balance technique. The results were compared with the performance of conventionally flux treated samples soldered in air and nitrogen atmospheres and nonflux treated samples soldered in air. An oxygen level of 200 ppm (parts per million) was used for all tests conducted under nitrogen atmosphere. The gas mixture used for the plasma cleaning was two noble gases, xenon/neon (Xe/Ne), and a molecular gas, oxygen (O/sub 2/) to obtain the combined effect of both physical sputtering and chemical etching respectively for increased etch rate. The results of Auger chemical analysis show a significant drop in organic (carbon) levels for the plasma treated samples. The significant drop in the level of carbon (C) leads to a decrease in contact angle and an increase in both surface energy and solder wettability. The results indicate that plasma cleaning using the Xe-O/sub 2/-Ne combination is a viable alternative to the use of flux in nitrogen soldering atmosphere.
Starting Page	172
Ending Page	186
File Size	807147
Page Count	15
File Format	PDF
ISBN	0780345231
ISSN	10898190
DOI	10.1109/IEMT.1998.731073
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1998-10-21
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Testing Nitrogen Atmosphere Plasma applications Plasma chemistry Soldering Cleaning Sputter etching Chemical compounds Chemical industry
Content Type	Text
Resource Type	Article
Subject	Industrial and Manufacturing Engineering Electrical and Electronic Engineering

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

Fluxless soldering in air and nitrogen

Novel surface coatings to enable fluxless soldering of copper surfaces [PCBs]

An experimental study on organic solderability preservative

Fluxless Soldering of Copper Substrates Using Self-Assembled Monolayers for Preservation

The association of component solderability testing with board level soldering performance

The Optimization of Chamber Cleaning in the Etching Equipment

Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques

Manufacturability improvements of inductively coupled plasma etch chambers in PVD tools

Wet chemical cleaning for damaged layer removal inside the deep sub-micron contact hole

Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering

Similar Documents

Fluxless soldering in air and nitrogen

Novel surface coatings to enable fluxless soldering of copper surfaces [PCBs]

An experimental study on organic solderability preservative

Fluxless Soldering of Copper Substrates Using Self-Assembled Monolayers for Preservation

The association of component solderability testing with board level soldering performance

The Optimization of Chamber Cleaning in the Etching Equipment

Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques

Manufacturability improvements of inductively coupled plasma etch chambers in PVD tools

Wet chemical cleaning for damaged layer removal inside the deep sub-micron contact hole

Solderability testing in nitrogen atmosphere of plasma treated HASL finish PCBs for fluxless soldering