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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chapuis, Y.-A. Debray, A. Fujita, H. |
| Copyright Year | 2007 |
| Description | Author affiliation: Tokyo Univ., Tokyo (Chapuis, Y.-A.) |
| Abstract | In this paper, we discuss a flip-chip packaging method using liquid solder for 3D large-scale electronic/MEMS co-integration. This approach has been inspired from self-assembly technique which is emerging as one of the main methods for fabrication of heterogeneous micro-and nano-systems. We proposed to form solder bump by coating liquid solder directly on electrodes of a MEMS chip based on sophisticate microstructures of electrostatic microactuator array. Self-alignment and assembly techniques for electronic receptor chip were also detailed in order to achieve efficient flip-chip of MEMS and Electronic chip without any stiction and contamination problem. Functionality of the system has been validated and perspectives discussed. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 2292098 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424413911 |
| DOI | 10.1109/ICEPT.2007.4441382 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-08-14 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Large-scale systems Micromechanical devices Assembly Electronics packaging Self-assembly Fabrication Coatings Electrodes Microstructure Electrostatics |
| Content Type | Text |
| Resource Type | Article |
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