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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Ping-Feng Yang Yi-Shao Lai Sheng-Rui Jian Jiumi Chen |
| Copyright Year | 2007 |
| Description | Author affiliation: Adv. Semicond. Eng. Inc., Kaohsiung (Ping-Feng Yang; Yi-Shao Lai) |
| Abstract | We report in tins paper Young's moduli and hardness of $Cu_{6}Sn_{5},$ $Cu_{3}Sn,$ and $Ni_{3}Sn_{4}$ intermetallic compounds (IMCs) measured by nanoindentation. The samples were prepared by annealing Sn-Cu and Sn-Ni diffusion couples. Indentations performed along the directions lateral and perpendicular to the IMC layers show statistically indistinguishable Young's moduli and hardness for each of the three IMCs. implying that these polycrystalline IMC aggregates are rather isotropic. Nanomechanical responses of the IMCs were shown to depend greatly on the strain rate during loading while independent of the strain rate during unloading. Multiple pop-in events were observed for $Cu_{6}Sn_{5}$ during loading at a strain rate lower than about 0.1 $s^{-1}$ to 0.5 $s^{-1}.$ Topographies of the residual impressions were quantitatively measured and the pile-up features were apparent for the three IMCs. |
| Starting Page | 1 |
| Ending Page | 5 |
| File Size | 1297295 |
| Page Count | 5 |
| File Format | |
| ISBN | 9781424413911 |
| DOI | 10.1109/ICEPT.2007.4441421 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-08-14 |
| Publisher Place | China |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Mechanical factors Capacitive sensors Annealing Intermetallic Substrates Mechanical variables measurement Surface topography Tin Temperature Soldering |
| Content Type | Text |
| Resource Type | Article |
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