NDLI: Influence of lanthanum addition on microstructure and properties of Sn-3.5Ag solder system

Content Provider	IEEE Xplore Digital Library
Author	Hwa-Teng Lee Yin-Fa Chen Ting-Fu Hong Yu-Jing Huang
Copyright Year	2008
Description	Author affiliation: Dept. of Mater. Eng., Nat. Pingtung Univ. of Sci. & Technol., Pingtung (Ting-Fu Hong) \|\| Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan (Hwa-Teng Lee; Yin-Fa Chen; Yu-Jing Huang)
Abstract	The goal of this research is to evaluate the effects of La addition on the microstructure and microhardness of Sn-Ag based solders. Sn-3.5Ag-xLa ternary alloy solder were prepared by adding 0-1.0 wt% La into a Sn-3.5Ag alloy. Copper substrates were then dipped into these solders and aged at 150degC for up to 625 hours. The microstructure and microhardness of the as solidified solder and the aged solder/copper couples were investigated. Experimental results show that Sn-3.5Ag-xLa solders are composed of beta-Sn, $Ag_{3}Sn$ and $LaSn_{3}$ phases, and their microstructure is refined with La addition. After isothermal aging, $Ag_{3}Sn$ and IMC layer can be effectively depressed by adding a small amount of La element, and the size and amount of $LaSn_{3}$ compounds did not change perceptibly with storage time. The addition of La increased the microhardness of the Sn-Ag solder due to the refining effect of $Ag_{3}Sn$ particles in eutectic and increased formation of $LaSn_{3}$ compound. After isothermal storage, the microhardness of solders was decreased with the increasing coarsening of $Ag_{3}Sn$ compounds as aging time was increased. However, coarsening of $Ag_{3}Sn$ compounds was retarded by La addition as revealed in this study. Therefore, La addition helped to improve the microhardness and thermal resistance of the solder joints.
Starting Page	183
Ending Page	186
File Size	4350500
Page Count	4
File Format	PDF
ISBN	9781424436200
DOI	10.1109/EMAP.2008.4784259
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-22
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lanthanum Microstructure Soldering Copper Aging Thermal resistance Optical microscopy Mechanical factors Mechanical engineering Optical materials
Content Type	Text
Resource Type	Article

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