NDLI: Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

Content Provider	IEEE Xplore Digital Library
Author	Young Min Kim Young-Ho Kim
Copyright Year	2008
Description	Author affiliation: Div. of Mater. Sci. & Eng., Hanyang Univ., Seoul, South Korea (Young Min Kim; Young-Ho Kim)
Abstract	The intermetallic growth in the Sn-Ag-Cu (SAC) solder joints fabricated on Cu or Cu-Zn solder wetting layer and its effect on the drop impact reliability have been studied. The drop test specimens were fabricated by connecting two printed circuit boards by reflowing SASC 405 solder balls on Cu or Cu-Zn wetting layers. And the drop test specimens were aged at 150degC up to 500 hrs. The well known bi-layer of $Cu_{6}Sn_{5}$ and $Cu_{3}Sn$ with microvoids was formed at the SAC/Cu interfaces during aging. On the other hand, only $Cu_{6}Sn_{5}$ formed at the SAC/Cu-Zn interfaces with aging. No $Cu_{3}Sn$ and microvoids were observed and the formation of large $Ag_{3}Sn$ plates was suppressed remarkably. Also, the growth rate of IMCs at the SAC/Cu-Zn interface was much slower than that at the SAC/Cu interface. The number of drops to failure in the Cu-Zn/SAC/Cu-Zn solder joints was higher than that in the Cu/SAC/Cu solder joints before and after aging. The microstructure developed in the solder interfaces greatly influenced the drop impact reliability.
Starting Page	236
Ending Page	238
File Size	3948459
Page Count	3
File Format	PDF
ISBN	9781424436200
DOI	10.1109/EMAP.2008.4784272
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-22
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Soldering Aging Optical microscopy Intermetallic Circuit testing Zinc Scanning electron microscopy Copper alloys Materials reliability Printed circuits
Content Type	Text
Resource Type	Article

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