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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Taeeui Kim KyungO Kim Hongwon Kim Taesung Jung Sung Yi |
| Copyright Year | 2008 |
| Description | Author affiliation: Samsung Electro-Mech. Co. Ltd., Suwon, South Korea (Taeeui Kim; KyungO Kim; Hongwon Kim; Taesung Jung; Sung Yi) |
| Abstract | This paper focuses on design issues brought by tolerance drifts of organic embedded passive technology and their potential effects in RF system applications. The embedded passive technology provides advantage in small form factor for RF modules which are very suitable for miniaturization with promising high level of integration however due to some factors both in the material properties and fabrication processes, their unstable performance especially at high RF is seen as a challenge. Applications operating at high frequency ranges from 1 GHz up to over 5 GHz where at system level there is a critical need for very tight tolerance because of the short wavelength and small geometric dimension. The factors that significantly affect the tolerance are analyzed in this study. Some factors are discussed with measurement data along with validation using simulation tools. This study suggests main issues that should be considered during product development using organic embedded passive technology. |
| Starting Page | 317 |
| Ending Page | 320 |
| File Size | 3139918 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424436200 |
| DOI | 10.1109/EMAP.2008.4784292 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2008-10-22 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Tolerance analysis Radio frequency Substrates Costs Material properties Fabrication Testing Wavelength measurement Product development Microwave technology |
| Content Type | Text |
| Resource Type | Article |
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