NDLI: New halogen-free laminate for advanced package substrate

Content Provider	IEEE Xplore Digital Library
Author	Tanabe, T. Irino, T. Ose, M. Sakai, K.
Copyright Year	2008
Description	Author affiliation: Hitachi Chem. Co. Ltd., Chikusei (Tanabe, T.; Irino, T.; Ose, M.; Sakai, K.)
Abstract	Nowadays, the demand for the printed wiring board (PWB) of the environment harmony type is rising rapidly. We have developed a new halogen-free material with low coefficients of thermal expansion (CTE), which will be applied to the plastic packages such as FC-BGA and CSP. The original resin system and filler treatment technique named FICS (filler interphase control system) were applied to the material. The newly developed halogen-free material named MCL-E-679FG(S) has a higher glass transition temperature (Tg), peel strength, and heat resistance than the conventional halogen-free materials. Their properties are advantageous to the melting temperature rise of the lead-free solder. Another newly developed halogen-free material named MCL-E-679GT has the lower CTE combined with standard glass fabric (E-glass). It has been developed by new resin system. Its advantage is to reduce of PKG warpage, such as package on package (PoP), during the heat process for the chip mounting. In order to meet fine-line formation, we developed profile-free copper foil. With the copper foil of 18 mum thickness, we have formed the fine line of 60 mum or less pitch by the conventional subtractive method. It will be effective for advanced package substrate such as high density CSP.
Starting Page	29
Ending Page	32
File Size	5555450
Page Count	4
File Format	PDF
ISBN	9781424436200
DOI	10.1109/EMAP.2008.4784221
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-22
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Laminates Chip scale packaging Resins Glass Temperature Copper Wiring Thermal expansion Plastic packaging Control systems
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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