NDLI: A novel high refractive transparent material in LED package applications

Content Provider	IEEE Xplore Digital Library
Author	Hsun-Tien Li Chia-Wen Hsu Kai-Chi Chen
Copyright Year	2008
Description	Author affiliation: Ind. Technol. Res. Inst., Hsinchu (Hsun-Tien Li; Chia-Wen Hsu; Kai-Chi Chen)
Abstract	In this study, we conversed Bisbromomethyl-biphenyl and thiourea to a new biphenyl dithiol (BPDT) and used it as a co-curing agent. Its structure was confirmed by means of F-TIR, $^{1}H-NMR,$ and MS spectra. We co-cured the conventional diglycidyl ether of Bisphenol A (DGEBA) epoxy resin with BPDT and aliphatic tetra-thiol (Pentaerythritol tetrakis(3-mercaptopropionate)) to get a colorless encapsulant (HRIL). The optical properties were measured after curing process. The refractive index was 1.64 which is the highest refractive index among the current existed LED encapsulant, and the transmittance of the cured HRIL was above 85% on the visible wavelength. Furthermore, the effect on light efficiency of LED was evaluated and found that the light efficiency was promoted 14%, compared with the conventional epoxy encapsulated LED. This result certainly reveals that the high refractive index encapsulant can effectively enhance the light efficiency of LED. We also analyzed the thermal mechanical property and thermal stability of the cured HRIL which contained a hindered amine light stabilizer (HALS) by TMA and TGA. The Tg of the cured HRIL was 85.2degC and the thermal decomposed temperature was 327.7degC. After 110degC/1000h thermal aging test, the decrease of transmittance was less than 5% and the thermal resistant result unveils that the novel high refractive index encapsulant is suitable for high performance LED applications.
Starting Page	309
Ending Page	312
File Size	2800994
Page Count	4
File Format	PDF
ISBN	9781424436200
DOI	10.1109/EMAP.2008.4784290
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	2008-10-22
Publisher Place	Taiwan
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Light emitting diodes Packaging Refractive index Thermal resistance Epoxy resins Optical refraction Optical variables control Wavelength measurement Curing Mechanical factors
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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