NDLI: A fine pitch COG technique for a TFT-LCD panel using an indium alloy

Content Provider	IEEE Xplore Digital Library
Author	Mori, M. Kizaki, Y. Saito, M. Hongu, A.
Copyright Year	1993
Description	Author affiliation: Toshiba Corp., Kawasaki, Japan (Mori, M.; Kizaki, Y.; Saito, M.; Hongu, A.)
Abstract	A fine pitch chip-on-glass (COG) bonding technique for liquid crystal display (LCD) panels has been developed. An IC chip with gold bumps was dipped in a stirred indium alloy bath in a nitrogen atmosphere without flux. Shallow-bowl-shaped In alloy bumps were selectively formed on the Au bumps on the IC electrodes. The minimum bump pitch was 50 /spl mu/m, and the bump size was 31 by 31 /spl mu/m. The In alloy bumps whose minimum pitch was 100 /spl mu/m were connected to molybdenum conductors without flux at low pressure (30 gf/bump or less) and low temperature (110/spl deg/C or less). The temperature was lower than the alloy melting point. The mean contact resistance was 0.78 /spl Omega/. It was found that the calculation of the minimum bump pitch for the bump sizes and the In alloy bump height is useful for designing new ICs with fine pitch bumps. It has been demonstrated through a thermal shock test (TST), a high temperature and high-humidity storage test; and a high-temperature storage test that the contact resistance changes satisfied the specification. Prototype TFT-LCD panels with 80-/spl mu/m pitch driver ICs were successfully developed.<>
Starting Page	992
Ending Page	996
File Size	407545
Page Count	5
File Format	PDF
ISBN	0780307941
DOI	10.1109/ECTC.1993.346732
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-06-01
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Indium Temperature Testing Gold alloys Contact resistance Bonding Liquid crystal displays Nitrogen Atmosphere Electrodes
Content Type	Text
Resource Type	Article

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1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
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