NDLI: AlO bonding: a method of joining oxide optical components to aluminum coated substrates

Content Provider	IEEE Xplore Digital Library
Author	Coucoulas, A. Benzoni, A.M. Dautartas, M.F. Dutta, R. Holland, W.R. Nijander, C.R. Woods, R.E.
Copyright Year	1993
Description	Author affiliation: AT&T Bell Labs., Princeton, NJ, USA (Coucoulas, A.)
Abstract	With the increased use of photonic packages, there are needs for reliable and low cost methods of attaching optical components. Packages based on silicon optical bench (SiOB) technology include oxide coated ball-lenses and silica fibers which are generally epoxied in anisotropically etched features of silicon substrates. The reliable attachment of these micro-optical components requires the application of small (approximately 1 nanoliter) quantities of epoxy at precise locations on the substrate. This is a time consuming process and requires considerable operator training and skill. Dispensing too much epoxy can deteriorate the optical performance of the device and dispensing too little results in an insufficient holding power. AlO bonding is an alternative attachment technique, under development, which forms solid-state bonds directly between these oxide-components and aluminum thin film coated silicon optical bench substrates and therefore does not require the handling of additives, such as epoxy, at the bond interface. This paper includes: methods of bonding ball-lenses and fibers; an interfacial analysis and proposed bonding mechanism derived from SEM/metallographic photomicrographs and thermodynamic data; destructive test results as a function of bonding and material parameters and; in situ loss measurements through AlO bonded components (multi-, single mode fibers and ball-lenses) during the bonding procedures and subsequent thermal cycling (-40 to 80/spl deg/C and from ambient to -195.8/spl deg/C) tests.<>
Starting Page	470
Ending Page	481
File Size	1072357
Page Count	12
File Format	PDF
ISBN	0780307941
DOI	10.1109/ECTC.1993.346803
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-06-01
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Bonding Optical devices Optical films Silicon Substrates Optical fiber testing Packaging Geometrical optics Materials testing Costs
Content Type	Text
Resource Type	Article

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