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| Content Provider | IEEE Xplore Digital Library |
|---|---|
| Author | Chao-Chyun An Shyh-Ming Chang Ming-Yao Chen Kuo-Shu Kao Jimmy Tsang Sheng-Shu Yang Chih Chen Chung-Kuang Lin Ren-Haw Chen Wen-Chih Chen |
| Copyright Year | 2007 |
| Description | Author affiliation: Display Technol. Center, Hsinchu (Chao-Chyun An; Shyh-Ming Chang) |
| Abstract | Non-Conductive-Film (NCF) type of Chip-on-Glass (COG) bonding method ensures the micro-order direct bonding between the IC electrode and glass substrate electrode. The binding force of the applied adhesive achieves electrical connections between the bumps on the IC chip and the electrodes on the glass substrate. The mathematical calculation results of bump stress and bump deformation are used to identify the environmental temperature range for the given COG bonding structure. Both of the calculation and experimental results demonstrate the feasibility of using the compliant bumps to achieve a high compressive stress, high bump deformation and low as well as stable connection resistance at various environmental temperatures. The 1,000 hrs 85degC/85%RH reliability test result will be indicated. |
| Starting Page | 14 |
| Ending Page | 17 |
| File Size | 144071 |
| Page Count | 4 |
| File Format | |
| ISBN | 9781424416363 |
| DOI | 10.1109/IMPACT.2007.4433558 |
| Language | English |
| Publisher | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Publisher Date | 2007-10-01 |
| Publisher Place | Taiwan |
| Access Restriction | Subscribed |
| Rights Holder | Institute of Electrical and Electronics Engineers, Inc. (IEEE) |
| Subject Keyword | Electrodes Thermal expansion Materials science and technology Temperature Compressive stress Glass Liquid crystal displays Bonding Thermal stresses Substrates |
| Content Type | Text |
| Resource Type | Article |
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