NDLI: Computer modeling of isothermal low-cycle fatigue of Pb-Sn solder joints

Content Provider	IEEE Xplore Digital Library
Author	Zhenfeng Guo Conrad, H.
Copyright Year	1993
Description	Author affiliation: Dept. of Mater. Sci. & Eng., North Carolina State Univ., Raleigh, NC, USA (Zhenfeng Guo; Conrad, H.)
Abstract	The low-cycle fatigue stress-strain hysteresis loops and Coffin-Manson (C-M) behavior of near-eutectic solder joints under isothermal conditions (300 K) in shear were modeled employing a plastic deformation constitutive equation combined with a fatigue crack growth rate (FCGR) equation. The constitutive equation is based on Dorn's high temperature creep equation, giving /spl gamma//spl dot//sub p/=AD/spl mu/b/kT [Sinh(/spl beta//spl tau///spl mu/)]/sup n/ where /spl gamma//spl dot/ is the plastic shear rate, D the appropriate diffusion constant, /spl mu/ the shear modulus, b the Burgers vector and /spl tau/ the shear stress. A, /spl beta/ and n are mechanism constants and kT has its usual meaning. The FCGR equation employed is based on the relationship experimentally determined by the authors, namely dA/sub c//dN=B/spl Delta/W/sub p//sup b/ where dAc/dN is the crack area growth rate and /spl Delta/W/sub p/ (=/spl Delta//spl tau//spl Delta//spl gamma//sub p/) is the plastic work per cycle. B and b are material constants. Reasonable agreement was found between the calculated and measured hysteresis loops and also the C-M behavior.<>
Starting Page	831
Ending Page	838
File Size	532458
Page Count	8
File Format	PDF
ISBN	0780307941
DOI	10.1109/ECTC.1993.346753
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1993-06-01
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Isothermal processes Fatigue Equations Plastics Hysteresis Soldering Deformable models Temperature Creep Stress
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in