NDLI: The effectiveness of Rad-Pak ICs for space-radiation hardening

Content Provider	IEEE Xplore Digital Library
Author	Millward, D.G. Strobel, D.J.
Copyright Year	1990
Description	Author affiliation: Sci. Applic. Int. Corp., San Diego, CA, USA (Millward, D.G.; Strobel, D.J.)
Abstract	Rad-Pak IC packages with radiation shields as an integral part of their structure have been designed and manufactured. Two styles were designed and fabricated assuming a fission-enhanced orbit: a 68 lead chip carrier designed to shield to the bremsstrahlung limit, and a 22 lead chip carrier providing forty-fold dose reduction. The accuracy of the computer models developed to design these packages was experimentally verified by irradiating dosimeters and functional ICs with 2-MeV electrons. The durability of the packages was demonstrated by testing samples of both designs to the test methods of MIL-STD-883C. There were no failures. The electrical and thermal characteristics of the Rad-Pak design were compared to those of standard IC packages of similar design. The shields were found to have only a slight effect on the electrical characteristics and to significantly improve the thermal properties of the Rad-Pak demonstration packages. Rad-Pak counterparts of some VHSIC packages have been designed. Computer studies of the efficiency of Rad-Pak packages as shields against ionizing radiation in space environments indicate weight savings as high as 80% over box shielding schemes.<>
Starting Page	913
Ending Page	916
File Size	334042
Page Count	4
File Format	PDF
DOI	10.1109/ECTC.1990.122298
Language	English
Publisher	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Publisher Date	1990-05-20
Publisher Place	USA
Access Restriction	Subscribed
Rights Holder	Institute of Electrical and Electronics Engineers, Inc. (IEEE)
Subject Keyword	Lead Integrated circuit packaging Electrons Testing Integrated circuit modeling Aluminum Assembly Nickel Gold Radiation hardening
Content Type	Text
Resource Type	Article

Sl.	Authority	Responsibilities	Communication Details
1	Ministry of Education (GoI), Department of Higher Education	Sanctioning Authority	https://www.education.gov.in/ict-initiatives
2	Indian Institute of Technology Kharagpur	Host Institute of the Project: The host institute of the project is responsible for providing infrastructure support and hosting the project	https://www.iitkgp.ac.in
3	National Digital Library of India Office, Indian Institute of Technology Kharagpur	The administrative and infrastructural headquarters of the project	Dr. B. Sutradhar bsutra@ndl.gov.in
4	Project PI / Joint PI	Principal Investigator and Joint Principal Investigators of the project	Dr. B. Sutradhar bsutra@ndl.gov.in Prof. Saswat Chakrabarti will be added soon
5	Website/Portal (Helpdesk)	Queries regarding NDLI and its services	support@ndl.gov.in
6	Contents and Copyright Issues	Queries related to content curation and copyright issues	content@ndl.gov.in
7	National Digital Library of India Club (NDLI Club)	Queries related to NDLI Club formation, support, user awareness program, seminar/symposium, collaboration, social media, promotion, and outreach	clubsupport@ndl.gov.in
8	Digital Preservation Centre (DPC)	Assistance with digitizing and archiving copyright-free printed books	dpc@ndl.gov.in
9	IDR Setup or Support	Queries related to establishment and support of Institutional Digital Repository (IDR) and IDR workshops	idr@ndl.gov.in

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